diff options
author | Rob Barnes <robbarnes@google.com> | 2020-02-20 14:35:51 -0700 |
---|---|---|
committer | Felix Held <felix-coreboot@felixheld.de> | 2020-03-19 10:31:08 +0000 |
commit | 5baadba532aec78d76d2ba1efea825b5f9b75efc (patch) | |
tree | 160a556a186f5c49923f86152ec4800de617fd66 | |
parent | 9d49598cd6f323d0119d905f9917f526e0c2920f (diff) | |
download | coreboot-5baadba532aec78d76d2ba1efea825b5f9b75efc.tar.xz |
util/bincfg: Add DDR4 SPD spec
Additionally provide a simple script for decoding spd hex files using bincfg.
BUG=b:148561711
TEST=Decoded spd files in zork
BRANCH=None
Change-Id: Ic62868d59e075fd6816d7be55cc935e3e3f82499
Signed-off-by: Rob Barnes <robbarnes@google.com>
Reviewed-on: https://chromium-review.googlesource.com/2067697
Reviewed-by: Martin Roth <martinroth@google.com>
Reviewed-by: Paul Fagerburg <pfagerburg@chromium.org>
Reviewed-on: https://review.coreboot.org/c/coreboot/+/39621
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Michael Niewöhner
-rw-r--r-- | util/bincfg/ddr4_registered_spd_512.spec | 362 | ||||
-rw-r--r-- | util/bincfg/ddr4_unbuffered_spd_512.spec | 335 | ||||
-rwxr-xr-x | util/scripts/decode_spd.sh | 76 | ||||
-rw-r--r-- | util/scripts/description.md | 2 |
4 files changed, 775 insertions, 0 deletions
diff --git a/util/bincfg/ddr4_registered_spd_512.spec b/util/bincfg/ddr4_registered_spd_512.spec new file mode 100644 index 0000000000..126091e8f0 --- /dev/null +++ b/util/bincfg/ddr4_registered_spd_512.spec @@ -0,0 +1,362 @@ +# 4_01_02_AnnexL-R25_SPD_for_DDR4_SDRAM_Release_3_Sep2015.pdf +# +# JEDEC Standard No. 21-C +# Page 4.1.2.12.3 – 1 +# Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules +# DDR4 SPD Document Release 3 +# UDIMM Revision 1.1 +# RDIMM Revision 1.1 +# LRDIMM Revision 1.1 +# NVDIMM Revision 1.0 + +{ + # Byte 0: Number of Bytes Used / Number of Bytes in SPD Device / + # CRC Coverage + "SPD_Bytes_Used" : 4, + "SPD_Bytes_Total" : 3, + "CRC_Coverage" : 1, + + # Byte 1: SPD Revision + "SPD_Revision" : 8, + + # Byte 2: Key Byte / DRAM Device Type + "DRAM_Device_Type" : 8, + + # Byte 3: Key Byte / Module Type + "Base_Module_Type" : 4, + "Hybrid_Media" : 3, + "Is_Hybrid" : 1, + + # Byte 4: SDRAM Density and Banks + "SDRAM_Capacity" : 4, + "Bank_Address_Bits" : 2, + "Bank_Group_Bits" : 2, + + # Byte 5: SDRAM Addressing + "Column_Address_Bits" : 3, + "Row_Address_Bits" : 3, + "Byte_5_reserved" : 2, + + # Byte 6: SDRAM Package Type + "Signal_Loading" : 2, + "Byte_6_reserved" : 2, + "Die_Count" : 3, + "SDRAM_Package_Type" : 1, + + # Byte 7: SDRAM Optional Features + "Maximum_Activate_Count" : 4, + "Maximum_Activate_Window" : 2, + "Byte_7_reserved" : 2, + + # Byte 8: SDRAM Thermal and Refresh Options + "Byte_8_reserved" : 8, + + # Byte 9: Other SDRAM Optional Features + "Byte_9_reserved" : 5, + "Soft_PPR" : 1, + "Post_Package_Repair" : 2, + + # Byte 10: Secondary SDRAM Package Type + "Secondary_Signal_Loading" : 2, + "Secondary_DRAM_Densityt_Ratio" : 2, + "Secondary_Die_Count" : 3, + "Secondary_SDRAM_Package_Type" : 1, + + # Byte 11: Module Nominal Voltage, VDD + "DRAM_VDD_1_2_V" : 2, + "Byte_11_reserved" : 6, + + # Byte 12: Module Organization + "SDRAM_Device_Width" : 3, + "Number_of_Package_Ranks_per_DIMM" : 3, + "Rank_Mix" : 1, + "Byte_12_reserved" : 1, + + # Byte 13: Module Memory Bus Width + "Primary_bus_width_in_bits" : 3, + "Bus_width_extension_in_bits" : 2, + "Byte_13_reserved" : 3, + + # Byte 14: Module Thermal Sensor + "Byte_14_reserved" : 7, + "Thermal_Sensor" : 1, + + # Byte 15: Extended Module Type + "Extended_Base_Module_Type" : 4, + "Byte_15_reserved" : 4, + + # Byte 16: Reserved + "Byte_16_reserved" : 8, + + # Byte 17: Timebases + "Fine_Timebase" : 2, + "Medium_Timebase" : 2, + "Byte_17_reserved" : 4, + + # Byte 18: SDRAM Minimum Cycle Time (tCKAVGmin) + "tCKAVGmin" : 8, + + # Byte 19: SDRAM Maximum Cycle Time (tCKAVGmax) + "tCKAVGmax" : 8, + + # Bytes 20 - 23: CAS Latencies Supported + "CL_7_Supported" : 1, + "CL_8_Supported" : 1, + "CL_9_Supported" : 1, + "CL_10_Supported" : 1, + "CL_11_Supported" : 1, + "CL_12_Supported" : 1, + "CL_13_Supported" : 1, + "CL_14_Supported" : 1, + + "CL_15_Supported" : 1, + "CL_16_Supported" : 1, + "CL_17_Supported" : 1, + "CL_18_Supported" : 1, + "CL_19_Supported" : 1, + "CL_20_Supported" : 1, + "CL_21_Supported" : 1, + "CL_22_Supported" : 1, + + "CL_23_Supported" : 1, + "CL_24_Supported" : 1, + "CL_25_Supported" : 1, + "CL_26_Supported" : 1, + "CL_27_Supported" : 1, + "CL_28_Supported" : 1, + "CL_29_Supported" : 1, + "CL_30_Supported" : 1, + + "CL_31_Supported" : 1, + "CL_32_Supported" : 1, + "CL_33_Supported" : 1, + "CL_34_Supported" : 1, + "CL_35_Supported" : 1, + "CL_36_Supported" : 1, + "Byte_23_reserved" : 1, + "CL_range" : 1, + + # Byte 24: Minimum CAS Latency Time (tAAmin) + "tAAmin" : 8, + + # Byte 25: Minimum RAS to CAS Delay Time (tRCDmin) + "tRCDmin" : 8, + + # Byte 26: Minimum Row Precharge Delay Time (tRPmin) + "tRPmin" : 8, + + # Bytes 27 - 29: Minimum Active to Precharge Delay Time (tRASmin) + # / Minimum Active to Active/Refresh Delay Time + # (tRCmin) + "tRASmin_MSN" : 4, + "tRCmin_MSN" : 4, + "tRASmin_LSB" : 8, + "tRCmin_LSB" : 8, + + # Bytes 30 - 31: Minimum Refresh Recovery Delay Time (tRFC1min) + "tRFC1min_LSB" : 8, + "tRFC1min_MSB" : 8, + + # Bytes 32 - 33: Minimum Refresh Recovery Delay Time (tRFC2min) + "tRFC2min_LSB" : 8, + "tRFC2min_MSB" : 8, + + # Bytes 34 - 35: Minimum Refresh Recovery Delay Time (tRFC4min) + "tRFC4min_LSB" : 8, + "tRFC4min_MSB" : 8, + + # Byte 36 - 37: Minimum Four Activate Window Delay Time + # (tFAWmin) + "tFAWmin_MSN" : 4, + "Byte_36_reserved" : 4, + "tFAWmin_LSB" : 8, + + # Bytes 38: Minimum Activate to Activate Delay Time (tRRD_Smin), + # different bank group + "tRRD_Smin" : 8, + + # Byte 39: Minimum Activate to Activate Delay Time (tRRD_Lmin), + # same bank group + "tRRD_Lmin" : 8, + + # Byte 40: Minimum CAS to CAS Delay Time (tCCD_Lmin), same bank + # group + "tCCD_Lmin" : 8, + + # Byte 41 - 42: Minimum Write Recovery Time (tWRmin) + "tWRmin_MSN" : 4, + "Byte_41_reserved" : 4, + "tWRmin_MSB" : 8, + + # Byte 43-45: Minimum Write to Read Time (tWTR_Smin), + # different bank group / Minimum Write to Read Time + # (tWTR_Lmin), same bank group + "tWTR_Smin_MSN" : 4, + "tWTR_Lmin_MSN" : 4, + "tWTR_Smin_LSB" : 8, + "tWTR_Lmin_LSB" : 8, + + # Byte 46~59: Reserved, Base Configuration Section + "Byte_46_59_reserved" [14] : 8, + + # Byte 60: Connector to SDRAM Bit Mapping (DQ0-3) + "DQ0_3" : 8, + # Byte 61: Connector to SDRAM Bit Mapping (DQ4-7) + "DQ4_7" : 8, + + # Byte 62: Connector to SDRAM Bit Mapping (DQ8-11) + "DQ8_11" : 8, + + # Byte 63: Connector to SDRAM Bit Mapping (DQ12-15) + "DQ12_15" : 8, + + # Byte 64: Connector to SDRAM Bit Mapping (DQ16-19) + "DQ16_19" : 8, + + # Byte 65: Connector to SDRAM Bit Mapping (DQ20-23) + "DQ20_23" : 8, + + # Byte 66: Connector to SDRAM Bit Mapping (DQ24-27) + "DQ24_27" : 8, + + # Byte 67: Connector to SDRAM Bit Mapping (DQ28-31) + "DQ28_31" : 8, + + # Byte 68: Connector to SDRAM Bit Mapping (CB0-3) + "CB0_3" : 8, + + # Byte 69: Connector to SDRAM Bit Mapping (CB4-7) + "CB4_7" : 8, + + # Byte 70: Connector to SDRAM Bit Mapping (DQ32-35) + "DQ32_35" : 8, + + # Byte 71: Connector to SDRAM Bit Mapping (DQ36-39) + "DQ36_39" : 8, + + # Byte 72: Connector to SDRAM Bit Mapping (DQ40-43) + "DQ40_43" : 8, + + # Byte 73: Connector to SDRAM Bit Mapping (DQ44-47) + "DQ44_47" : 8, + + # Byte 74: Connector to SDRAM Bit Mapping (DQ48-51) + "DQ48_51" : 8, + + # Byte 75: Connector to SDRAM Bit Mapping (DQ52-55) + "DQ52_55" : 8, + + # Byte 76: Connector to SDRAM Bit Mapping (DQ56-59) + "DQ56_59" : 8, + + # Byte 77: Connector to SDRAM Bit Mapping (DQ60-63) + "DQ60_63" : 8, + + # Bytes 78~116: Reserved, Base Configuration Section + # Must be coded as 0x00 + "Byte_78_116_reserved" [39] : 8, + + # Byte 117: Fine Offset for Minimum CAS to CAS Delay Time + # (tCCD_Lmin), same bank group + "tCCD_Lmin" : 8, + + # Byte 118: Fine Offset for Minimum Activate to Activate Delay + # Time (tRRD_Lmin), same bank group + "tRRD_Lmin" : 8, + + # Byte 119: Fine Offset for Minimum Activate to Activate Delay + # Time (tRRD_Smin), different bank group + "tRRD_Smin" : 8, + + # Byte 120: Fine Offset for Minimum Active to Active/Refresh + # Delay Time (tRCmin) + "tRCmin" : 8, + + # Byte 121: Fine Offset for Minimum Row Precharge Delay + # Time (tRPmin) + "tRPmin" : 8, + + # Byte 122: Fine Offset for Minimum RAS to CAS Delay + # Time (tRCDmin) + "tRCDmin" : 8, + + # Byte 123: Fine Offset for Minimum CAS Latency Time (tAAmin) + "tAAmin" : 8, + + # Byte 124: Fine Offset for SDRAM Maximum Cycle Time + # (tCKAVGmax) + "tCKAVGmax" : 8, + + # Byte 125: Fine Offset for SDRAM Minimum Cycle Time + # (tCKAVGmin) + "tCKAVGmin" : 8, + + # Byte 126 - 127: Cyclical Redundancy Code (CRC) for + # Base Configuration Section + "CRC_Base_Configuration" : 16, + +# Standard Module Parameters - Overlay Bytes 128~191 +# Module Specific Bytes for Registered Memory Module Types + + # Byte 128: Raw Card Extension, Module Nominal Height + "Module_Nominal_Height_Max" : 5, + "Raw_Card_Extension" : 3, + + # Byte 129: Module Maximum Thickness + "Module_Maximum_Thickness_Front" : 4, + "Module_Maximum_Thickness_Back" : 4, + + # Byte 130: Reference Raw Card Used + "Reference_Raw_Card" : 5, + "Reference_Raw_Card_Revision" : 2, + "Reference_Raw_Card_Extension" : 1, + + # Byte 131: DIMM Attributes + "Number_of_Registers_used_on_RDIMM" : 2, + "Number_of_DRAMS_on_RDIMM" : 2, + "Register_Type" : 4, + + # Byte 132: RDIMM Thermal Heat Spreader Solution + "Heat_Spreader_Thermal_Characteristics" : 7, + "Heat_Spreader_Solution" : 1, + + # Byte 133 - 134: Register Manufacturer ID Code + "Register_Manufacturer_ID_Code" : 16, + + # Byte 135: Register Revision Number + "Register_Revision_Number" : 8, + + # Byte 136: Address Mapping from Register to DRAM + "Rank_1_Mapping" : 1, + "Byte_136_Reserved" : 7, + + # Byte 137: Register Output Drive Strength for + # Control and Command/Address + "Register_Output_Drive_CKE" : 2, + "Register_Output_Drive_ODT" : 2, + "Register_Output_Drive_Command_Address" : 2, + "Register_Output_Drive_Chip_Select" : 2, + + # Byte 138: Register Output Drive Strength for Clock + "Register_Output_Drive_Strength_Clock_Y0_Y2" : 2, + "Register_Output_Drive_Strength_Clock_Y1_Y3" : 2, + "Byte_138_reserved" : 4, + + # Byte 139 - 191: Reserved + "Byte_139_191" [53] : 8, + +# Unused + # Byte 192 - 253: Unused + "Byte_192_255_unused" [62] : 8, + + # Byte 254 - 255: CRC for SPD Block 1 + "CRC_SPD_Block_1" : 16, + +# Reserved + # Byte 256 - 319: Reserved + "Byte_256_319_reserved" [64] : 8, + +# End User Programmable + # Byte 384 - 511 + "End_User_Programmable" [128] : 8 +} diff --git a/util/bincfg/ddr4_unbuffered_spd_512.spec b/util/bincfg/ddr4_unbuffered_spd_512.spec new file mode 100644 index 0000000000..594258e16b --- /dev/null +++ b/util/bincfg/ddr4_unbuffered_spd_512.spec @@ -0,0 +1,335 @@ +# 4_01_02_AnnexL-R25_SPD_for_DDR4_SDRAM_Release_3_Sep2015.pdf +# +# JEDEC Standard No. 21-C +# Page 4.1.2.12.3 – 1 +# Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules +# DDR4 SPD Document Release 3 +# UDIMM Revision 1.1 +# RDIMM Revision 1.1 +# LRDIMM Revision 1.1 +# NVDIMM Revision 1.0 + +{ + # Byte 0: Number of Bytes Used / Number of Bytes in SPD Device / + # CRC Coverage + "SPD_Bytes_Used" : 4, + "SPD_Bytes_Total" : 3, + "CRC_Coverage" : 1, + + # Byte 1: SPD Revision + "SPD_Revision" : 8, + + # Byte 2: Key Byte / DRAM Device Type + "DRAM_Device_Type" : 8, + + # Byte 3: Key Byte / Module Type + "Base_Module_Type" : 4, + "Hybrid_Media" : 3, + "Is_Hybrid" : 1, + + # Byte 4: SDRAM Density and Banks + "SDRAM_Capacity" : 4, + "Bank_Address_Bits" : 2, + "Bank_Group_Bits" : 2, + + # Byte 5: SDRAM Addressing + "Column_Address_Bits" : 3, + "Row_Address_Bits" : 3, + "Byte_5_reserved" : 2, + + # Byte 6: SDRAM Package Type + "Signal_Loading" : 2, + "Byte_6_reserved" : 2, + "Die_Count" : 3, + "SDRAM_Package_Type" : 1, + + # Byte 7: SDRAM Optional Features + "Maximum_Activate_Count" : 4, + "Maximum_Activate_Window" : 2, + "Byte_7_reserved" : 2, + + # Byte 8: SDRAM Thermal and Refresh Options + "Byte_8_reserved" : 8, + + # Byte 9: Other SDRAM Optional Features + "Byte_9_reserved" : 5, + "Soft_PPR" : 1, + "Post_Package_Repair" : 2, + + # Byte 10: Secondary SDRAM Package Type + "Secondary_Signal_Loading" : 2, + "Secondary_DRAM_Densityt_Ratio" : 2, + "Secondary_Die_Count" : 3, + "Secondary_SDRAM_Package_Type" : 1, + + # Byte 11: Module Nominal Voltage, VDD + "DRAM_VDD_1_2_V" : 2, + "Byte_11_reserved" : 6, + + # Byte 12: Module Organization + "SDRAM_Device_Width" : 3, + "Number_of_Package_Ranks_per_DIMM" : 3, + "Rank_Mix" : 1, + "Byte_12_reserved" : 1, + + # Byte 13: Module Memory Bus Width + "Primary_bus_width_in_bits" : 3, + "Bus_width_extension_in_bits" : 2, + "Byte_13_reserved" : 3, + + # Byte 14: Module Thermal Sensor + "Byte_14_reserved" : 7, + "Thermal_Sensor" : 1, + + # Byte 15: Extended Module Type + "Extended_Base_Module_Type" : 4, + "Byte_15_reserved" : 4, + + # Byte 16: Reserved + "Byte_16_reserved" : 8, + + # Byte 17: Timebases + "Fine_Timebase" : 2, + "Medium_Timebase" : 2, + "Byte_17_reserved" : 4, + + # Byte 18: SDRAM Minimum Cycle Time (tCKAVGmin) + "tCKAVGmin" : 8, + + # Byte 19: SDRAM Maximum Cycle Time (tCKAVGmax) + "tCKAVGmax" : 8, + + # Bytes 20 - 23: CAS Latencies Supported + "CL_7_Supported" : 1, + "CL_8_Supported" : 1, + "CL_9_Supported" : 1, + "CL_10_Supported" : 1, + "CL_11_Supported" : 1, + "CL_12_Supported" : 1, + "CL_13_Supported" : 1, + "CL_14_Supported" : 1, + + "CL_15_Supported" : 1, + "CL_16_Supported" : 1, + "CL_17_Supported" : 1, + "CL_18_Supported" : 1, + "CL_19_Supported" : 1, + "CL_20_Supported" : 1, + "CL_21_Supported" : 1, + "CL_22_Supported" : 1, + + "CL_23_Supported" : 1, + "CL_24_Supported" : 1, + "CL_25_Supported" : 1, + "CL_26_Supported" : 1, + "CL_27_Supported" : 1, + "CL_28_Supported" : 1, + "CL_29_Supported" : 1, + "CL_30_Supported" : 1, + + "CL_31_Supported" : 1, + "CL_32_Supported" : 1, + "CL_33_Supported" : 1, + "CL_34_Supported" : 1, + "CL_35_Supported" : 1, + "CL_36_Supported" : 1, + "Byte_23_reserved" : 1, + "CL_range" : 1, + + # Byte 24: Minimum CAS Latency Time (tAAmin) + "tAAmin" : 8, + + # Byte 25: Minimum RAS to CAS Delay Time (tRCDmin) + "tRCDmin" : 8, + + # Byte 26: Minimum Row Precharge Delay Time (tRPmin) + "tRPmin" : 8, + + # Bytes 27 - 29: Minimum Active to Precharge Delay Time (tRASmin) + # / Minimum Active to Active/Refresh Delay Time + # (tRCmin) + "tRASmin_MSN" : 4, + "tRCmin_MSN" : 4, + "tRASmin_LSB" : 8, + "tRCmin_LSB" : 8, + + # Bytes 30 - 31: Minimum Refresh Recovery Delay Time (tRFC1min) + "tRFC1min_LSB" : 8, + "tRFC1min_MSB" : 8, + + # Bytes 32 - 33: Minimum Refresh Recovery Delay Time (tRFC2min) + "tRFC2min_LSB" : 8, + "tRFC2min_MSB" : 8, + + # Bytes 34 - 35: Minimum Refresh Recovery Delay Time (tRFC4min) + "tRFC4min_LSB" : 8, + "tRFC4min_MSB" : 8, + + # Byte 36 - 37: Minimum Four Activate Window Delay Time + # (tFAWmin) + "tFAWmin_MSN" : 4, + "Byte_36_reserved" : 4, + "tFAWmin_LSB" : 8, + + # Bytes 38: Minimum Activate to Activate Delay Time (tRRD_Smin), + # different bank group + "tRRD_Smin" : 8, + + # Byte 39: Minimum Activate to Activate Delay Time (tRRD_Lmin), + # same bank group + "tRRD_Lmin" : 8, + + # Byte 40: Minimum CAS to CAS Delay Time (tCCD_Lmin), same bank + # group + "tCCD_Lmin" : 8, + + # Byte 41 - 42: Minimum Write Recovery Time (tWRmin) + "tWRmin_MSN" : 4, + "Byte_41_reserved" : 4, + "tWRmin_MSB" : 8, + + # Byte 43-45: Minimum Write to Read Time (tWTR_Smin), + # different bank group / Minimum Write to Read Time + # (tWTR_Lmin), same bank group + "tWTR_Smin_MSN" : 4, + "tWTR_Lmin_MSN" : 4, + "tWTR_Smin_LSB" : 8, + "tWTR_Lmin_LSB" : 8, + + # Byte 46~59: Reserved, Base Configuration Section + "Byte_46_59_reserved" [14] : 8, + + # Byte 60: Connector to SDRAM Bit Mapping (DQ0-3) + "DQ0_3" : 8, + # Byte 61: Connector to SDRAM Bit Mapping (DQ4-7) + "DQ4_7" : 8, + + # Byte 62: Connector to SDRAM Bit Mapping (DQ8-11) + "DQ8_11" : 8, + + # Byte 63: Connector to SDRAM Bit Mapping (DQ12-15) + "DQ12_15" : 8, + + # Byte 64: Connector to SDRAM Bit Mapping (DQ16-19) + "DQ16_19" : 8, + + # Byte 65: Connector to SDRAM Bit Mapping (DQ20-23) + "DQ20_23" : 8, + + # Byte 66: Connector to SDRAM Bit Mapping (DQ24-27) + "DQ24_27" : 8, + + # Byte 67: Connector to SDRAM Bit Mapping (DQ28-31) + "DQ28_31" : 8, + + # Byte 68: Connector to SDRAM Bit Mapping (CB0-3) + "CB0_3" : 8, + + # Byte 69: Connector to SDRAM Bit Mapping (CB4-7) + "CB4_7" : 8, + + # Byte 70: Connector to SDRAM Bit Mapping (DQ32-35) + "DQ32_35" : 8, + + # Byte 71: Connector to SDRAM Bit Mapping (DQ36-39) + "DQ36_39" : 8, + + # Byte 72: Connector to SDRAM Bit Mapping (DQ40-43) + "DQ40_43" : 8, + + # Byte 73: Connector to SDRAM Bit Mapping (DQ44-47) + "DQ44_47" : 8, + + # Byte 74: Connector to SDRAM Bit Mapping (DQ48-51) + "DQ48_51" : 8, + + # Byte 75: Connector to SDRAM Bit Mapping (DQ52-55) + "DQ52_55" : 8, + + # Byte 76: Connector to SDRAM Bit Mapping (DQ56-59) + "DQ56_59" : 8, + + # Byte 77: Connector to SDRAM Bit Mapping (DQ60-63) + "DQ60_63" : 8, + + # Bytes 78~116: Reserved, Base Configuration Section + # Must be coded as 0x00 + "Byte_78_116_reserved" [39] : 8, + + # Byte 117: Fine Offset for Minimum CAS to CAS Delay Time + # (tCCD_Lmin), same bank group + "tCCD_Lmin_Fine_Offset" : 8, + + # Byte 118: Fine Offset for Minimum Activate to Activate Delay + # Time (tRRD_Lmin), same bank group + "tRRD_Lmin_Fine_Offset" : 8, + + # Byte 119: Fine Offset for Minimum Activate to Activate Delay + # Time (tRRD_Smin), different bank group + "tRRD_Smin_Fine_Offset" : 8, + + # Byte 120: Fine Offset for Minimum Active to Active/Refresh + # Delay Time (tRCmin) + "tRCmin_Fine_Offset" : 8, + + # Byte 121: Fine Offset for Minimum Row Precharge Delay + # Time (tRPmin) + "tRPmin_Fine_Offset" : 8, + + # Byte 122: Fine Offset for Minimum RAS to CAS Delay + # Time (tRCDmin) + "tRCDmin_Fine_Offset" : 8, + + # Byte 123: Fine Offset for Minimum CAS Latency Time (tAAmin) + "tAAmin_Fine_Offset" : 8, + + # Byte 124: Fine Offset for SDRAM Maximum Cycle Time + # (tCKAVGmax) + "tCKAVGmax_Fine_Offset" : 8, + + # Byte 125: Fine Offset for SDRAM Minimum Cycle Time + # (tCKAVGmin) + "tCKAVGmin_Fine_Offset" : 8, + + # Byte 126 - 127: Cyclical Redundancy Code (CRC) for + # Base Configuration Section + "CRC_Base_Configuration" : 16, + +# Standard Module Parameters - Overlay Bytes 128~191 +# Module Specific Bytes for Unbuffered Memory Module Types + + # Byte 128: Raw Card Extension, Module Nominal Height + "Module_Nominal_Height_Max" : 5, + "Raw_Card_Extension" : 3, + + # Byte 129: Module Maximum Thickness + "Module_Maximum_Thickness_Front" : 4, + "Module_Maximum_Thickness_Back" : 4, + + # Byte 130: Reference Raw Card Used + "Reference_Raw_Card" : 5, + "Reference_Raw_Card_Revision" : 2, + "Reference_Raw_Card_Extension" : 1, + + # Byte 131: Address Mapping from Edge Connector to DRAM + "Rank_1_Mapping" : 1, + "Byte_131_reserved" : 7, + + # Byte 132 - 191: Reserved + "Byte_132_191_reserved" [60] : 8, + +# Unused + # Byte 192 - 253: Unused + "Byte_192_255_unused" [62] : 8, + + # Byte 254 - 255: CRC for SPD Block 1 + "CRC_SPD_Block_1" : 16, + +# Reserved + # Byte 256 - 319: Reserved + "Byte_256_319_reserved" [64] : 8, + +# End User Programmable + # Byte 384 - 511 + "End_User_Programmable" [128] : 8 +} diff --git a/util/scripts/decode_spd.sh b/util/scripts/decode_spd.sh new file mode 100755 index 0000000000..9ab9fa30cf --- /dev/null +++ b/util/scripts/decode_spd.sh @@ -0,0 +1,76 @@ +#!/bin/bash +# +# This file is part of the coreboot project. +# +# This program is free software; you can redistribute it and/or modify +# it under the terms of the GNU General Public License as published by +# the Free Software Foundation; version 2 of the License. +# +# This program is distributed in the hope that it will be useful, +# but WITHOUT ANY WARRANTY; without even the implied warranty of +# MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the +# GNU General Public License for more details. +# +# +# Parses spd hex files and outputs the contents in various formats +# +# +# Outputs csv, set, and json in same folder as SPD_HEX_FILE +# +# Example: +# decode_spd.sh ../../src/mainboard/google/zork/spd/micron-MT40A512M16TB-062E-J.spd.hex +# +# Outputs ../../src/mainboard/google/zork/spd/micron-MT40A512M16TB-062E-J.spd.{json|csv|set} +# +# TODO: This script assumes bincfg binary is at ../bincfg/bincfg (which is the +# result of running the bincfg make), and the specs are at +# ../bincfg/*.spec. This dependency should be made more resilliant and +# configurable. + +set -e + +function read8 () { + echo $(( 16#$(xxd -s "${2}" -l 1 -p "${1}") )) +} + +for file in "$@" +do + bintmp=$(mktemp) + outfile="${file%.hex}.set" + + echo "Decoding ${file}, outputting to ${outfile}" + + grep -v '^#' "${file}" | xxd -r -p - "${bintmp}" + dram_type=$(read8 "${bintmp}" 2) + if [ ! "${dram_type}" -eq 12 ] + then + #TODO: Handle other dram types + printf "Error: Expecting dram4 (12), got %d\n" "${dram_type}" + continue + fi + + revision=$(read8 "${bintmp}" 1) + if [ ! "${revision}" -eq $((0x13)) ] + then + printf "Warning: Expecting revision 0x13, got 0x%x.\n" "${revision}" + fi + + module_type=$(read8 "${bintmp}" 3) + case "${module_type}" in + 1) # RDIMM + spec="../bincfg/ddr4_registered_spd_512.spec" + ;; + 2 | 3) #UDIMM | SO-DIMM + spec="../bincfg/ddr4_unbuffered_spd_512.spec" + ;; + * ) + printf "Error: Unhandled module type %d.\n" "${module_type}" + ;; + esac + + ../bincfg/bincfg -d "${spec}" "${bintmp}" "${outfile}" + grep -v '^#' "${outfile}" | sed -e 's/ = \([^,]\+\)/: "\1"/g' \ + > "${file%.hex}.json" + grep -v -e '^#' -e '^{' -e '^}' "${outfile}" | sed -e 's/=/,/g' \ + > "${file%.hex}.csv" +done diff --git a/util/scripts/description.md b/util/scripts/description.md index 1f4e7df042..a08771d48d 100644 --- a/util/scripts/description.md +++ b/util/scripts/description.md @@ -3,6 +3,8 @@ __scripts__ line `Bash` * _cross-repo-cherrypick_ - Pull in patches from another tree from a gerrit repository. `Shell` + * _decode_spd.sh_ - Decodes Serial Presence Detect (SPD) files into + various human readable formats. * _dts-to-fmd.sh_ -Converts a depthcharge fmap.dts into an fmaptool compatible .fmd format `Bash` * _find-unused-kconfig-symbols.sh_ - Points out Kconfig variables |