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+# Lenovo X301
+
+## Disassembly Instructions
+
+You must remove the following parts to access the SPI flash:
+
+![X301 with WSON8 chip replaced with SOIC8 chip](x301_kb_removed.jpg)
+
+* Battery pack
+* Keyboard
+
+Its [Hardware Maintenance Manual](https://download.lenovo.com/ibmdl/pub/pc/pccbbs/mobiles_pdf/43y9441.pdf) can be used as a guidance of disassembly.
+
+The WSON-8 flash chip (surrounded with red circle in the photo above,
+already replaced with a SOIC-8 one) sits under a piece of insulating
+tape. If solders between the chip and soldering pads fortunately
+overflows beside the chip as tiny tin balls attached to soldering pads,
+it will be possible to use a pomona 5250 clip to hold the chip, with
+its metal tips just attached to tin balls, thus connecting the chip to
+the programmer. Otherwise, it may be recommended to replace it with a
+SOIC-8 one (you might need to add the chip to the IFD VSCC list), as
+what is done in the photo.
+
+The vendor IFD VSCC list contains:
+ -MACRONIX_MX25L6405 (0xc2, 0x2017)
+ -WINBOND_NEX_W25X64 (0xef, 0x3017)
+ -ATMEL_AT25DF641 (0x1f, 0x4800)
+
+```eval_rst
+:doc:`../../flash_tutorial/ext_power`
+```
+Tested:
+ - CPU Core 2 Duo U9400
+ - Slotted DIMM 4GiB*2 from samsung
+ - Camera
+ - pci-e slots
+ - sata and usb2
+ - libgfxinit-based graphic init
+ - NVRAM options for North and South bridges
+ - Sound
+ - Thinkpad EC
+ - S3
+ - Linux 4.19.67-2 within Debian GNU/Linux stable, loaded from
+ Linux payload (Heads) and Seabios.