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diff --git a/src/mainboard/amd/db-ft3b-lc/Memphis_MEM4G16D3EABG.spd.hex b/src/mainboard/amd/db-ft3b-lc/Memphis_MEM4G16D3EABG.spd.hex
deleted file mode 100644
index 3bbe027a88..0000000000
--- a/src/mainboard/amd/db-ft3b-lc/Memphis_MEM4G16D3EABG.spd.hex
+++ /dev/null
@@ -1,237 +0,0 @@
-#
-# This file is part of the coreboot project.
-#
-# This program is free software; you can redistribute it and/or modify
-# it under the terms of the GNU General Public License as published by
-# the Free Software Foundation; version 2 of the License.
-#
-# This program is distributed in the hope that it will be useful,
-# but WITHOUT ANY WARRANTY; without even the implied warranty of
-# MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
-# GNU General Public License for more details.
-#
-
-# LOWCOST board has 2GB using 4 Memphis MEM4G16D3EABG chips
-
-# The datasheet is available at:
-# http://www.memphis.ag/fileadmin/datasheets/MEM4G16D3EABG_10.pdf
-
-# SPD contents for LC (LowCost) 4GB DDR3 (1600MHz) soldered down
-
-# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage
-# bits[3:0]: 1 = 128 SPD Bytes Used
-# bits[6:4]: 1 = 256 SPD Bytes Total
-# bit7 : 0 = CRC covers bytes 0 ~ 125
-11
-
-# 1 SPD Revision -
-# 0x10 = Revision 1.0
-10
-
-# 2 Key Byte / DRAM Device Type
-# bits[7:0]: 0x0b = DDR3 SDRAM
-0B
-
-# 3 Key Byte / Module Type
-# bits[3:0]: 1 = RDIMM
-# bits[3:0]: 2 = UDIMM
-# bits[3:0]: 3 = SO-DIMM
-# bits[7:4]: reserved
-03
-
-# 4 SDRAM CHIP Density and Banks
-# bits[3:0]: 3 = 2 Gigabits Total SDRAM capacity per chip
-# bits[3:0]: 4 = 4 Gigabits Total SDRAM capacity per chip
-# bits[6:4]: 0 = 3 (8 banks)
-# bit7 : reserved
-04
-
-# 5 SDRAM Addressing
-# bits[2:0]: 1 = 10 Column Address Bits
-# bits[5:3]: 2 = 14 Row Address Bits
-# bits[5:3]: 3 = 15 Row Address Bits
-# bits[7:6]: reserved
-19
-
-# 6 Module Nominal Voltage, VDD
-# bit0 : 0 = 1.5 V operable
-# bit1 : 0 = NOT 1.35 V operable
-# bit2 : 0 = NOT 1.25 V operable
-# bits[7:3]: reserved
-00
-
-# 7 Module Organization
-# bits[2:0]: 2 = 16 bits
-# bits[5:3]: 0 = 1 Rank
-# bits[7:6]: reserved
-02
-
-# 8 Module Memory Bus Width
-# bits[2:0]: 3 = Primary bus width is 64 bits
-# bits[4:3]: 0 = 0 bits (no bus width extension)
-# bits[7:5]: reserved
-03
-
-# 9 Fine Timebase (FTB) Dividend / Divisor
-# bits[3:0]: 0x02 divisor
-# bits[7:4]: 0x05 dividend
-# 5/2 = 2.5ps
-52
-
-# 10 Medium Timebase (MTB) Dividend
-# 11 Medium Timebase (MTB) Divisor
-# 1 / 8 = .125 ns - used for clock freq of 400 through 1066 MHz
-01 08
-
-# 12 SDRAM Minimum Cycle Time (tCKmin)
-# 0x0a = tCKmin of 1.25 ns = DDR3-1600 (800 MHz clock)
-0A
-
-# 13 Reserved
-00
-
-# 14 CAS Latencies Supported, Least Significant Byte
-# 15 CAS Latencies Supported, Most Significant Byte
-# Cas Latencies of 11 - 5 are supported
-FE 00
-
-# 16 Minimum CAS Latency Time (tAAmin)
-# 0x6E = 13.75ns - DDR3-1600K
-6E
-
-# 17 Minimum Write Recovery Time (tWRmin)
-# 0x78 = tWR of 15ns - All DDR3 speed grades
-78
-
-# 18 Minimum RAS# to CAS# Delay Time (tRCDmin)
-# 0x6E = 13.75ns - DDR3-1600K
-6E
-
-# 19 Minimum Row Active to Row Active Delay Time (tRRDmin)
-# 0x3C = 7.5ns
-3C
-
-# 20 Minimum Row Precharge Delay Time (tRPmin)
-# 0x6E = 13.75ns - DDR3-1600K
-6E
-
-# 21 Upper Nibbles for tRAS and tRC
-# bits[3:0]: tRAS most significant nibble = 1 (see byte 22)
-# bits[7:4]: tRC most significant nibble = 1 (see byte 23)
-11
-
-# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB
-# 0x118 = 35ns - DDR3-1600 (see byte 21)
-2C
-
-# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB
-# 0x186 = 48.75ns - DDR3-1600K
-95
-
-# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB
-# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB
-# 0x500 = 160ns - for 2 Gigabit chips
-# 0x820 = 260ns - for 4 Gigabit chips
-20 08
-
-# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin)
-# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins
-3C
-
-# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin)
-# 0x3c = 7.5ns - All DDR3 SDRAM speed bins
-3C
-
-# 28 Upper Nibble for tFAWmin
-# 29 Minimum Four Activate Window Delay Time (tFAWmin)
-# 0x0140 = 40ns - DDR3-1600, 2 KB page size
-# 0x00F0 = 30ns - DDR3-1600, 2 KB page size
-00 F0
-
-# 30 SDRAM Optional Feature
-# bit0 : 1= RZQ/6 supported
-# bit1 : 1 = RZQ/7 supported
-# bits[6:2]: reserved
-# bit7 : 1 = DLL Off mode supported
-83
-
-# 31 SDRAM Thermal and Refresh Options
-# bit0 : 1 = Temp up to 95c supported
-# bit1 : 0 = 85-95c uses 2x refresh rate
-# bit2 : 1 = Auto Self Refresh supported
-# bit3 : 0 = no on die thermal sensor
-# bits[6:4]: reserved
-# bit7 : 0 = partial self refresh supported
-05
-
-# 32 Module Thermal Sensor
-# 0 = Thermal sensor not incorporated onto this assembly
-00
-
-# 33 SDRAM Device Type
-# bits[1:0]: 0 = Signal Loading not specified
-# bits[3:2]: reserved
-# bits[6:4]: 0 = Die count not specified
-# bit7 : 0 = Standard Monolithic DRAM Device
-00
-
-# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin)
-# 35 Fine Offset for Minimum CAS Latency Time (tAAmin)
-# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin)
-# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin)
-# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin)
-00 00 00 00 00
-
-# 39 - 59 (reserved)
-00 00 00 00 00 00 00 00
-00 00 00 00 00 00 00 00
-00 00 00 00 00
-
-# 60 Raw Card Extension, Module Nominal Height
-# bits[4:0]: 0 = <= 15mm tall
-# bits[7:5]: 0 = raw card revision 0-3
-00
-
-# 61 Module Maximum Thickness
-# bits[3:0]: 0 = thickness front <= 1mm
-# bits[7:4]: 0 = thinkness back <= 1mm
-00
-
-# 62 Reference Raw Card Used
-# bits[4:0]: 0 = Reference Raw card A used
-# bits[6:5]: 0 = revision 0
-# bit7 : 0 = Reference raw cards A through AL
-00
-
-# 63 Address Mapping from Edge Connector to DRAM
-# bit0 : 0 = standard mapping (not mirrored)
-# bits[7:1]: reserved
-00
-
-# 64 - 116 (reserved)
-00 00 00 00 00 00 00 00
-00 00 00 00 00 00 00 00
-00 00 00 00 00 00 00 00
-00 00 00 00 00 00 00 00
-00 00 00 00 00 00 00 00
-00 00 00 00 00 00 00 00
-00 00 00 00 00
-
-# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code
-# 0x0001 = AMD
-00 01
-
-# 119 Module ID: Module Manufacturing Location - oem specified
-# 120 Module ID: Module Manufacture Year in BCD
-# 0x14 = 2014
-00 14
-
-# 121 Module ID: Module Manufacture week
-# 0x12 = 12th week
-12
-
-# 122 - 125: Module Serial Number
-00 00 00 00
-
-# 126 - 127: Cyclical Redundancy Code
-00 00