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Diffstat (limited to 'src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/CHINTLV')
-rw-r--r--src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/CHINTLV/mfchi.c238
-rw-r--r--src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/CHINTLV/mfchi.h107
2 files changed, 345 insertions, 0 deletions
diff --git a/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/CHINTLV/mfchi.c b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/CHINTLV/mfchi.c
new file mode 100644
index 0000000000..29b8cc4e28
--- /dev/null
+++ b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/CHINTLV/mfchi.c
@@ -0,0 +1,238 @@
+/* $NoKeywords:$ */
+/**
+ * @file
+ *
+ * mfchi.c
+ *
+ * Feature Channel interleaving support
+ *
+ * @xrefitem bom "File Content Label" "Release Content"
+ * @e project: AGESA
+ * @e sub-project: (Mem/Feat/Chintlv)
+ * @e \$Revision: 63425 $ @e \$Date: 2011-12-22 11:24:10 -0600 (Thu, 22 Dec 2011) $
+ *
+ **/
+/*****************************************************************************
+ *
+ * Copyright 2008 - 2012 ADVANCED MICRO DEVICES, INC. All Rights Reserved.
+ *
+ * AMD is granting you permission to use this software (the Materials)
+ * pursuant to the terms and conditions of your Software License Agreement
+ * with AMD. This header does *NOT* give you permission to use the Materials
+ * or any rights under AMD's intellectual property. Your use of any portion
+ * of these Materials shall constitute your acceptance of those terms and
+ * conditions. If you do not agree to the terms and conditions of the Software
+ * License Agreement, please do not use any portion of these Materials.
+ *
+ * CONFIDENTIALITY: The Materials and all other information, identified as
+ * confidential and provided to you by AMD shall be kept confidential in
+ * accordance with the terms and conditions of the Software License Agreement.
+ *
+ * LIMITATION OF LIABILITY: THE MATERIALS AND ANY OTHER RELATED INFORMATION
+ * PROVIDED TO YOU BY AMD ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED
+ * WARRANTY OF ANY KIND, INCLUDING BUT NOT LIMITED TO WARRANTIES OF
+ * MERCHANTABILITY, NONINFRINGEMENT, TITLE, FITNESS FOR ANY PARTICULAR PURPOSE,
+ * OR WARRANTIES ARISING FROM CONDUCT, COURSE OF DEALING, OR USAGE OF TRADE.
+ * IN NO EVENT SHALL AMD OR ITS LICENSORS BE LIABLE FOR ANY DAMAGES WHATSOEVER
+ * (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS
+ * INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF AMD'S NEGLIGENCE,
+ * GROSS NEGLIGENCE, THE USE OF OR INABILITY TO USE THE MATERIALS OR ANY OTHER
+ * RELATED INFORMATION PROVIDED TO YOU BY AMD, EVEN IF AMD HAS BEEN ADVISED OF
+ * THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE
+ * EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES,
+ * THE ABOVE LIMITATION MAY NOT APPLY TO YOU.
+ *
+ * AMD does not assume any responsibility for any errors which may appear in
+ * the Materials or any other related information provided to you by AMD, or
+ * result from use of the Materials or any related information.
+ *
+ * You agree that you will not reverse engineer or decompile the Materials.
+ *
+ * NO SUPPORT OBLIGATION: AMD is not obligated to furnish, support, or make any
+ * further information, software, technical information, know-how, or show-how
+ * available to you. Additionally, AMD retains the right to modify the
+ * Materials at any time, without notice, and is not obligated to provide such
+ * modified Materials to you.
+ *
+ * U.S. GOVERNMENT RESTRICTED RIGHTS: The Materials are provided with
+ * "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is
+ * subject to the restrictions as set forth in FAR 52.227-14 and
+ * DFAR252.227-7013, et seq., or its successor. Use of the Materials by the
+ * Government constitutes acknowledgement of AMD's proprietary rights in them.
+ *
+ * EXPORT ASSURANCE: You agree and certify that neither the Materials, nor any
+ * direct product thereof will be exported directly or indirectly, into any
+ * country prohibited by the United States Export Administration Act and the
+ * regulations thereunder, without the required authorization from the U.S.
+ * government nor will be used for any purpose prohibited by the same.
+ * ***************************************************************************
+ *
+ */
+
+
+/*
+ *----------------------------------------------------------------------------
+ * MODULES USED
+ *
+ *----------------------------------------------------------------------------
+ */
+
+
+
+#include "AGESA.h"
+#include "mm.h"
+#include "mn.h"
+#include "mfchi.h"
+#include "Ids.h"
+#include "GeneralServices.h"
+#include "Filecode.h"
+CODE_GROUP (G2_PEI)
+RDATA_GROUP (G2_PEI)
+
+#define FILECODE PROC_MEM_FEAT_CHINTLV_MFCHI_FILECODE
+/*----------------------------------------------------------------------------
+ * DEFINITIONS AND MACROS
+ *
+ *----------------------------------------------------------------------------
+ */
+#define _4GB_ (0x10000ul >> 10)
+
+/*----------------------------------------------------------------------------
+ * TYPEDEFS AND STRUCTURES
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * PROTOTYPES OF LOCAL FUNCTIONS
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * EXPORTED FUNCTIONS
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/* -----------------------------------------------------------------------------*/
+/**
+ *
+ * MemFInterleaveChannels:
+ *
+ * Applies DIMM channel interleaving if enabled, if not ganged mode, and
+ * there are valid dimms in both channels. Called once per Node.
+ *
+ * @param[in,out] *NBPtr - Pointer to the MEM_NB_BLOCK
+ *
+ * @return TRUE - This feature is enabled.
+ * @return FALSE - This feature is not enabled.
+ */
+
+BOOLEAN
+MemFInterleaveChannels (
+ IN OUT MEM_NB_BLOCK *NBPtr
+ )
+{
+ UINT32 DramBase;
+ UINT32 DctSelBase;
+ UINT32 HoleSize;
+ UINT32 HoleBase;
+ UINT32 HoleOffset;
+ UINT32 Dct0Size;
+ UINT32 Dct1Size;
+ UINT32 SmallerDct;
+ UINT8 DctSelIntLvAddr;
+ UINT8 DctSelHi;
+ UINT8 DctSelHiRngEn;
+ UINT32 HoleValid;
+
+ MEM_PARAMETER_STRUCT *RefPtr;
+ DIE_STRUCT *MCTPtr;
+
+ ASSERT (NBPtr != NULL);
+
+ RefPtr = NBPtr->RefPtr;
+
+ DctSelIntLvAddr = NBPtr->DefDctSelIntLvAddr;
+ if (RefPtr->EnableChannelIntlv) {
+ HoleSize = 0;
+ HoleBase = 0;
+ if (RefPtr->GStatus[GsbSoftHole] || RefPtr->GStatus[GsbHWHole]) {
+ // HoleBase scaled from [47:16] to [47:26]
+ HoleBase = RefPtr->HoleBase >> 10;
+ HoleSize = _4GB_ - HoleBase;
+ }
+
+ MCTPtr = NBPtr->MCTPtr;
+
+ HoleValid = NBPtr->GetBitField (NBPtr, BFDramHoleValid);
+ if ((!MCTPtr->GangedMode) &&
+ (MCTPtr->DctData[0].Timings.DctMemSize != 0) &&
+ (MCTPtr->DctData[1].Timings.DctMemSize != 0)) {
+ // DramBase scaled [47:16] to [47:26]
+ DramBase = MCTPtr->NodeSysBase >> 10;
+ // Scale NodeSysLimit [47:16] to [47:26]
+ Dct1Size = (MCTPtr->NodeSysLimit + 1) >> 10;
+ Dct0Size = NBPtr->GetBitField (NBPtr, BFDctSelBaseOffset);
+ if ((Dct0Size >= _4GB_) && (DramBase < HoleBase)) {
+ Dct0Size -= HoleSize;
+ }
+ if ((Dct1Size >= _4GB_) && (DramBase < HoleBase)) {
+ Dct1Size -= HoleSize;
+ }
+ Dct1Size -= Dct0Size;
+ Dct0Size -= DramBase;
+
+ // Select the bigger size DCT to put in DctSelHi
+ DctSelHiRngEn = 1;
+ DctSelHi = 0;
+ SmallerDct = Dct1Size;
+ if (Dct1Size == Dct0Size) {
+ SmallerDct = 0;
+ DctSelHiRngEn = 0;
+ } else if (Dct1Size > Dct0Size) {
+ SmallerDct = Dct0Size;
+ DctSelHi = 1;
+ }
+
+ if (SmallerDct != 0) {
+ DctSelBase = (SmallerDct * 2) + DramBase;
+ } else {
+ DctSelBase = 0;
+ }
+ if ((DctSelBase >= HoleBase) && (DramBase < HoleBase)) {
+ DctSelBase += HoleSize;
+ }
+ IDS_OPTION_HOOK (IDS_CHANNEL_INTERLEAVE, &DctSelIntLvAddr, &(NBPtr->MemPtr->StdHeader));
+ NBPtr->SetBitField (NBPtr, BFDctSelBaseAddr, DctSelBase >> 1);
+ NBPtr->SetBitField (NBPtr, BFDctSelHiRngEn, DctSelHiRngEn);
+ NBPtr->SetBitField (NBPtr, BFDctSelHi, DctSelHi);
+ NBPtr->SetBitField (NBPtr, BFDctSelIntLvAddr, DctSelIntLvAddr);
+ NBPtr->SetBitField (NBPtr, BFDctSelIntLvEn, 1);
+
+ // DctSelBaseOffset = DctSelBaseAddr - Interleaved region
+ NBPtr->SetBitField (NBPtr, BFDctSelBaseOffset, DctSelBase - SmallerDct);
+
+ // Adjust DramHoleOffset
+ if (HoleValid != 0) {
+ HoleOffset = DramBase;
+ if ((DctSelBase < HoleBase) && (DctSelBase != 0)) {
+ HoleOffset += (DctSelBase - DramBase) >> 1;
+ }
+ HoleOffset += HoleSize;
+ NBPtr->SetBitField (NBPtr, BFDramHoleOffset, HoleOffset << 3);
+ }
+ } else {
+ //
+ // Channel Interleaving is requested but cannot be enabled
+ //
+ PutEventLog (AGESA_WARNING, MEM_WARNING_CHANNEL_INTERLEAVING_NOT_ENABLED, NBPtr->Node, 0, 0, 0, &NBPtr->MemPtr->StdHeader);
+ SetMemError (AGESA_WARNING, MCTPtr);
+ }
+
+ return TRUE;
+ } else {
+ return FALSE;
+ }
+}
diff --git a/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/CHINTLV/mfchi.h b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/CHINTLV/mfchi.h
new file mode 100644
index 0000000000..a9cde96d2b
--- /dev/null
+++ b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/CHINTLV/mfchi.h
@@ -0,0 +1,107 @@
+/* $NoKeywords:$ */
+/**
+ * @file
+ *
+ * mfchi.h
+ *
+ * Feature channel interleaving
+ *
+ * @xrefitem bom "File Content Label" "Release Content"
+ * @e project: AGESA
+ * @e sub-project: (Mem)
+ * @e \$Revision: 63425 $ @e \$Date: 2011-12-22 11:24:10 -0600 (Thu, 22 Dec 2011) $
+ *
+ **/
+/*****************************************************************************
+ *
+ * Copyright 2008 - 2012 ADVANCED MICRO DEVICES, INC. All Rights Reserved.
+ *
+ * AMD is granting you permission to use this software (the Materials)
+ * pursuant to the terms and conditions of your Software License Agreement
+ * with AMD. This header does *NOT* give you permission to use the Materials
+ * or any rights under AMD's intellectual property. Your use of any portion
+ * of these Materials shall constitute your acceptance of those terms and
+ * conditions. If you do not agree to the terms and conditions of the Software
+ * License Agreement, please do not use any portion of these Materials.
+ *
+ * CONFIDENTIALITY: The Materials and all other information, identified as
+ * confidential and provided to you by AMD shall be kept confidential in
+ * accordance with the terms and conditions of the Software License Agreement.
+ *
+ * LIMITATION OF LIABILITY: THE MATERIALS AND ANY OTHER RELATED INFORMATION
+ * PROVIDED TO YOU BY AMD ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED
+ * WARRANTY OF ANY KIND, INCLUDING BUT NOT LIMITED TO WARRANTIES OF
+ * MERCHANTABILITY, NONINFRINGEMENT, TITLE, FITNESS FOR ANY PARTICULAR PURPOSE,
+ * OR WARRANTIES ARISING FROM CONDUCT, COURSE OF DEALING, OR USAGE OF TRADE.
+ * IN NO EVENT SHALL AMD OR ITS LICENSORS BE LIABLE FOR ANY DAMAGES WHATSOEVER
+ * (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS
+ * INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF AMD'S NEGLIGENCE,
+ * GROSS NEGLIGENCE, THE USE OF OR INABILITY TO USE THE MATERIALS OR ANY OTHER
+ * RELATED INFORMATION PROVIDED TO YOU BY AMD, EVEN IF AMD HAS BEEN ADVISED OF
+ * THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE
+ * EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES,
+ * THE ABOVE LIMITATION MAY NOT APPLY TO YOU.
+ *
+ * AMD does not assume any responsibility for any errors which may appear in
+ * the Materials or any other related information provided to you by AMD, or
+ * result from use of the Materials or any related information.
+ *
+ * You agree that you will not reverse engineer or decompile the Materials.
+ *
+ * NO SUPPORT OBLIGATION: AMD is not obligated to furnish, support, or make any
+ * further information, software, technical information, know-how, or show-how
+ * available to you. Additionally, AMD retains the right to modify the
+ * Materials at any time, without notice, and is not obligated to provide such
+ * modified Materials to you.
+ *
+ * U.S. GOVERNMENT RESTRICTED RIGHTS: The Materials are provided with
+ * "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is
+ * subject to the restrictions as set forth in FAR 52.227-14 and
+ * DFAR252.227-7013, et seq., or its successor. Use of the Materials by the
+ * Government constitutes acknowledgement of AMD's proprietary rights in them.
+ *
+ * EXPORT ASSURANCE: You agree and certify that neither the Materials, nor any
+ * direct product thereof will be exported directly or indirectly, into any
+ * country prohibited by the United States Export Administration Act and the
+ * regulations thereunder, without the required authorization from the U.S.
+ * government nor will be used for any purpose prohibited by the same.
+ * ***************************************************************************
+ *
+ */
+
+
+#ifndef _MFCHI_H_
+#define _MFCHI_H_
+
+/*----------------------------------------------------------------------------
+ * Mixed (DEFINITIONS AND MACROS / TYPEDEFS, STRUCTURES, ENUMS)
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*-----------------------------------------------------------------------------
+ * DEFINITIONS AND MACROS
+ *
+ *-----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * TYPEDEFS, STRUCTURES, ENUMS
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * FUNCTIONS PROTOTYPE
+ *
+ *----------------------------------------------------------------------------
+ */
+
+BOOLEAN
+MemFInterleaveChannels (
+ IN OUT MEM_NB_BLOCK *NBPtr
+ );
+
+#endif /* _MFCHI_H_ */
+
+