diff options
Diffstat (limited to 'src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/ODTHERMAL')
-rw-r--r-- | src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/ODTHERMAL/mfodthermal.c | 199 | ||||
-rw-r--r-- | src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/ODTHERMAL/mfodthermal.h | 104 |
2 files changed, 303 insertions, 0 deletions
diff --git a/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/ODTHERMAL/mfodthermal.c b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/ODTHERMAL/mfodthermal.c new file mode 100644 index 0000000000..84449b1e2e --- /dev/null +++ b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/ODTHERMAL/mfodthermal.c @@ -0,0 +1,199 @@ +/* $NoKeywords:$ */ +/** + * @file + * + * mfodthermal.c + * + * On Dimm thermal management. + * + * @xrefitem bom "File Content Label" "Release Content" + * @e project: AGESA + * @e sub-project: (Mem/Feat) + * @e \$Revision: 63425 $ @e \$Date: 2011-12-22 11:24:10 -0600 (Thu, 22 Dec 2011) $ + * + **/ +/***************************************************************************** +* +* Copyright 2008 - 2012 ADVANCED MICRO DEVICES, INC. All Rights Reserved. +* +* AMD is granting you permission to use this software (the Materials) +* pursuant to the terms and conditions of your Software License Agreement +* with AMD. This header does *NOT* give you permission to use the Materials +* or any rights under AMD's intellectual property. Your use of any portion +* of these Materials shall constitute your acceptance of those terms and +* conditions. If you do not agree to the terms and conditions of the Software +* License Agreement, please do not use any portion of these Materials. +* +* CONFIDENTIALITY: The Materials and all other information, identified as +* confidential and provided to you by AMD shall be kept confidential in +* accordance with the terms and conditions of the Software License Agreement. +* +* LIMITATION OF LIABILITY: THE MATERIALS AND ANY OTHER RELATED INFORMATION +* PROVIDED TO YOU BY AMD ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED +* WARRANTY OF ANY KIND, INCLUDING BUT NOT LIMITED TO WARRANTIES OF +* MERCHANTABILITY, NONINFRINGEMENT, TITLE, FITNESS FOR ANY PARTICULAR PURPOSE, +* OR WARRANTIES ARISING FROM CONDUCT, COURSE OF DEALING, OR USAGE OF TRADE. +* IN NO EVENT SHALL AMD OR ITS LICENSORS BE LIABLE FOR ANY DAMAGES WHATSOEVER +* (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS +* INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF AMD'S NEGLIGENCE, +* GROSS NEGLIGENCE, THE USE OF OR INABILITY TO USE THE MATERIALS OR ANY OTHER +* RELATED INFORMATION PROVIDED TO YOU BY AMD, EVEN IF AMD HAS BEEN ADVISED OF +* THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE +* EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES, +* THE ABOVE LIMITATION MAY NOT APPLY TO YOU. +* +* AMD does not assume any responsibility for any errors which may appear in +* the Materials or any other related information provided to you by AMD, or +* result from use of the Materials or any related information. +* +* You agree that you will not reverse engineer or decompile the Materials. +* +* NO SUPPORT OBLIGATION: AMD is not obligated to furnish, support, or make any +* further information, software, technical information, know-how, or show-how +* available to you. Additionally, AMD retains the right to modify the +* Materials at any time, without notice, and is not obligated to provide such +* modified Materials to you. +* +* U.S. GOVERNMENT RESTRICTED RIGHTS: The Materials are provided with +* "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is +* subject to the restrictions as set forth in FAR 52.227-14 and +* DFAR252.227-7013, et seq., or its successor. Use of the Materials by the +* Government constitutes acknowledgement of AMD's proprietary rights in them. +* +* EXPORT ASSURANCE: You agree and certify that neither the Materials, nor any +* direct product thereof will be exported directly or indirectly, into any +* country prohibited by the United States Export Administration Act and the +* regulations thereunder, without the required authorization from the U.S. +* government nor will be used for any purpose prohibited by the same. +* *************************************************************************** +* +*/ + +/* + *---------------------------------------------------------------------------- + * MODULES USED + * + *---------------------------------------------------------------------------- + */ + + + +#include "AGESA.h" +#include "mm.h" +#include "mn.h" +#include "mt.h" +#include "Ids.h" +#include "mfodthermal.h" +#include "Filecode.h" +CODE_GROUP (G2_PEI) +RDATA_GROUP (G2_PEI) + +#define FILECODE PROC_MEM_FEAT_ODTHERMAL_MFODTHERMAL_FILECODE + +/*---------------------------------------------------------------------------- + * DEFINITIONS AND MACROS + * + *---------------------------------------------------------------------------- + */ + +/*---------------------------------------------------------------------------- + * TYPEDEFS AND STRUCTURES + * + *---------------------------------------------------------------------------- + */ + +/*---------------------------------------------------------------------------- + * PROTOTYPES OF LOCAL FUNCTIONS + * + *---------------------------------------------------------------------------- + */ + +/*---------------------------------------------------------------------------- + * EXPORTED FUNCTIONS + * + *---------------------------------------------------------------------------- + */ +/*-----------------------------------------------------------------------------*/ +/** + * + * This function does On-Dimm thermal management. + * + * @param[in, out] *NBPtr - Pointer to the MEM_NB_BLOCK. + * + * @return TRUE - This feature is enabled. + * @return FALSE - This feature is not enabled. + */ + +BOOLEAN +MemFOnDimmThermal ( + IN OUT MEM_NB_BLOCK *NBPtr + ) +{ + UINT8 i; + UINT8 Dct; + CH_DEF_STRUCT *ChannelPtr; + MEM_DATA_STRUCT *MemPtr; + UINT8 *SpdBufferPtr; + UINT8 ThermalOp; + BOOLEAN ODTSEn; + BOOLEAN ExtendTmp; + + ODTSEn = FALSE; + ExtendTmp = FALSE; + + ASSERT (NBPtr != NULL); + MemPtr = NBPtr->MemPtr; + AGESA_TESTPOINT (TpProcMemOnDimmThermal, &MemPtr->StdHeader); + if (NBPtr->MCTPtr->NodeMemSize != 0) { + for (Dct = 0; Dct < NBPtr->DctCount; Dct++) { + NBPtr->SwitchDCT (NBPtr, Dct); + // Only go through the DCT if it is not disabled. + if (NBPtr->GetBitField (NBPtr, BFDisDramInterface) == 0) { + ChannelPtr = NBPtr->ChannelPtr; + // If Ganged mode is enabled, need to go through all dram devices on both DCTs. + if (!NBPtr->Ganged || (NBPtr->Dct != 1)) { + if (!(NBPtr->IsSupported[CheckSetSameDctODTsEn]) || (NBPtr->IsSupported[CheckSetSameDctODTsEn] && (NBPtr->Dct != 1))) { + ODTSEn = TRUE; + ExtendTmp = TRUE; + } + } + for (i = 0; i < MAX_DIMMS_PER_CHANNEL; i ++) { + if (NBPtr->TechPtr->GetDimmSpdBuffer (NBPtr->TechPtr, &SpdBufferPtr, i)) { + // Check byte 31: thermal and refresh option. + ThermalOp = SpdBufferPtr[THERMAL_OPT]; + // Bit 3: ODTS readout + if (!((ThermalOp >> 3) & 1)) { + ODTSEn = FALSE; + } + // Bit 0: Extended Temperature Range. + if (!(ThermalOp & 1)) { + ExtendTmp = FALSE; + } + } + } + + if (!NBPtr->Ganged || (NBPtr->Dct == 1)) { + // If in ganged mode, need to switch back to DCT0 to set the registers. + if (NBPtr->Ganged || NBPtr->IsSupported[CheckSetSameDctODTsEn]) { + NBPtr->SwitchDCT (NBPtr, 0); + ChannelPtr = NBPtr->ChannelPtr; + } + // If all dram devices on support ODTS + NBPtr->SetBitField (NBPtr, BFODTSEn, (ODTSEn == TRUE) ? 1 : 0); + ChannelPtr->ExtendTmp = ExtendTmp; + } + } + IDS_HDT_CONSOLE (MEM_FLOW, "\tDct %d\n", Dct); + IDS_HDT_CONSOLE (MEM_FLOW, "\t\tODTSEn = %d\n", ODTSEn); + IDS_HDT_CONSOLE (MEM_FLOW, "\t\tExtendTmp = %d\n", ExtendTmp); + } + } + return TRUE; +} + + +/*---------------------------------------------------------------------------- + * LOCAL FUNCTIONS + * + *---------------------------------------------------------------------------- + */ diff --git a/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/ODTHERMAL/mfodthermal.h b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/ODTHERMAL/mfodthermal.h new file mode 100644 index 0000000000..1015e66ac9 --- /dev/null +++ b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Feat/ODTHERMAL/mfodthermal.h @@ -0,0 +1,104 @@ +/* $NoKeywords:$ */ +/** + * @file + * + * mfodthermal.h + * + * Header file for On-Dimm thermal management. + * + * @xrefitem bom "File Content Label" "Release Content" + * @e project: AGESA + * @e sub-project: (Mem) + * @e \$Revision: 63425 $ @e \$Date: 2011-12-22 11:24:10 -0600 (Thu, 22 Dec 2011) $ + * + **/ +/***************************************************************************** +* +* Copyright 2008 - 2012 ADVANCED MICRO DEVICES, INC. All Rights Reserved. +* +* AMD is granting you permission to use this software (the Materials) +* pursuant to the terms and conditions of your Software License Agreement +* with AMD. This header does *NOT* give you permission to use the Materials +* or any rights under AMD's intellectual property. Your use of any portion +* of these Materials shall constitute your acceptance of those terms and +* conditions. If you do not agree to the terms and conditions of the Software +* License Agreement, please do not use any portion of these Materials. +* +* CONFIDENTIALITY: The Materials and all other information, identified as +* confidential and provided to you by AMD shall be kept confidential in +* accordance with the terms and conditions of the Software License Agreement. +* +* LIMITATION OF LIABILITY: THE MATERIALS AND ANY OTHER RELATED INFORMATION +* PROVIDED TO YOU BY AMD ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED +* WARRANTY OF ANY KIND, INCLUDING BUT NOT LIMITED TO WARRANTIES OF +* MERCHANTABILITY, NONINFRINGEMENT, TITLE, FITNESS FOR ANY PARTICULAR PURPOSE, +* OR WARRANTIES ARISING FROM CONDUCT, COURSE OF DEALING, OR USAGE OF TRADE. +* IN NO EVENT SHALL AMD OR ITS LICENSORS BE LIABLE FOR ANY DAMAGES WHATSOEVER +* (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS +* INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF AMD'S NEGLIGENCE, +* GROSS NEGLIGENCE, THE USE OF OR INABILITY TO USE THE MATERIALS OR ANY OTHER +* RELATED INFORMATION PROVIDED TO YOU BY AMD, EVEN IF AMD HAS BEEN ADVISED OF +* THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE +* EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES, +* THE ABOVE LIMITATION MAY NOT APPLY TO YOU. +* +* AMD does not assume any responsibility for any errors which may appear in +* the Materials or any other related information provided to you by AMD, or +* result from use of the Materials or any related information. +* +* You agree that you will not reverse engineer or decompile the Materials. +* +* NO SUPPORT OBLIGATION: AMD is not obligated to furnish, support, or make any +* further information, software, technical information, know-how, or show-how +* available to you. Additionally, AMD retains the right to modify the +* Materials at any time, without notice, and is not obligated to provide such +* modified Materials to you. +* +* U.S. GOVERNMENT RESTRICTED RIGHTS: The Materials are provided with +* "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is +* subject to the restrictions as set forth in FAR 52.227-14 and +* DFAR252.227-7013, et seq., or its successor. Use of the Materials by the +* Government constitutes acknowledgement of AMD's proprietary rights in them. +* +* EXPORT ASSURANCE: You agree and certify that neither the Materials, nor any +* direct product thereof will be exported directly or indirectly, into any +* country prohibited by the United States Export Administration Act and the +* regulations thereunder, without the required authorization from the U.S. +* government nor will be used for any purpose prohibited by the same. +* *************************************************************************** +* +*/ + +#ifndef _MFODTHERMAL_H_ +#define _MFODTHERMAL_H_ + +/*---------------------------------------------------------------------------- + * Mixed (DEFINITIONS AND MACROS / TYPEDEFS, STRUCTURES, ENUMS) + * + *---------------------------------------------------------------------------- + */ + +/*----------------------------------------------------------------------------- + * DEFINITIONS AND MACROS + * + *----------------------------------------------------------------------------- + */ + +/*---------------------------------------------------------------------------- + * TYPEDEFS, STRUCTURES, ENUMS + * + *---------------------------------------------------------------------------- + */ + +/*---------------------------------------------------------------------------- + * FUNCTIONS PROTOTYPE + * + *---------------------------------------------------------------------------- + */ + +BOOLEAN +MemFOnDimmThermal ( + IN OUT MEM_NB_BLOCK *NBPtr + ); + +#endif //_MFODTHERMAL_H_ |