diff options
Diffstat (limited to 'src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FP2')
-rw-r--r-- | src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FP2/mpStnfp2.c | 196 |
1 files changed, 196 insertions, 0 deletions
diff --git a/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FP2/mpStnfp2.c b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FP2/mpStnfp2.c new file mode 100644 index 0000000000..51a4421d80 --- /dev/null +++ b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FP2/mpStnfp2.c @@ -0,0 +1,196 @@ +/* $NoKeywords:$ */ +/** + * @file + * + * mpStnfp2.c + * + * Platform specific settings for TN DDR3 SO-DIMM FP2 system + * + * @xrefitem bom "File Content Label" "Release Content" + * @e project: AGESA + * @e sub-project: (Mem/Ps/TN/FP2) + * @e \$Revision: 63425 $ @e \$Date: 2011-12-22 11:24:10 -0600 (Thu, 22 Dec 2011) $ + * + **/ +/***************************************************************************** + * + * Copyright 2008 - 2012 ADVANCED MICRO DEVICES, INC. All Rights Reserved. + * + * AMD is granting you permission to use this software (the Materials) + * pursuant to the terms and conditions of your Software License Agreement + * with AMD. This header does *NOT* give you permission to use the Materials + * or any rights under AMD's intellectual property. Your use of any portion + * of these Materials shall constitute your acceptance of those terms and + * conditions. If you do not agree to the terms and conditions of the Software + * License Agreement, please do not use any portion of these Materials. + * + * CONFIDENTIALITY: The Materials and all other information, identified as + * confidential and provided to you by AMD shall be kept confidential in + * accordance with the terms and conditions of the Software License Agreement. + * + * LIMITATION OF LIABILITY: THE MATERIALS AND ANY OTHER RELATED INFORMATION + * PROVIDED TO YOU BY AMD ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED + * WARRANTY OF ANY KIND, INCLUDING BUT NOT LIMITED TO WARRANTIES OF + * MERCHANTABILITY, NONINFRINGEMENT, TITLE, FITNESS FOR ANY PARTICULAR PURPOSE, + * OR WARRANTIES ARISING FROM CONDUCT, COURSE OF DEALING, OR USAGE OF TRADE. + * IN NO EVENT SHALL AMD OR ITS LICENSORS BE LIABLE FOR ANY DAMAGES WHATSOEVER + * (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS + * INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF AMD'S NEGLIGENCE, + * GROSS NEGLIGENCE, THE USE OF OR INABILITY TO USE THE MATERIALS OR ANY OTHER + * RELATED INFORMATION PROVIDED TO YOU BY AMD, EVEN IF AMD HAS BEEN ADVISED OF + * THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE + * EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES, + * THE ABOVE LIMITATION MAY NOT APPLY TO YOU. + * + * AMD does not assume any responsibility for any errors which may appear in + * the Materials or any other related information provided to you by AMD, or + * result from use of the Materials or any related information. + * + * You agree that you will not reverse engineer or decompile the Materials. + * + * NO SUPPORT OBLIGATION: AMD is not obligated to furnish, support, or make any + * further information, software, technical information, know-how, or show-how + * available to you. Additionally, AMD retains the right to modify the + * Materials at any time, without notice, and is not obligated to provide such + * modified Materials to you. + * + * U.S. GOVERNMENT RESTRICTED RIGHTS: The Materials are provided with + * "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is + * subject to the restrictions as set forth in FAR 52.227-14 and + * DFAR252.227-7013, et seq., or its successor. Use of the Materials by the + * Government constitutes acknowledgement of AMD's proprietary rights in them. + * + * EXPORT ASSURANCE: You agree and certify that neither the Materials, nor any + * direct product thereof will be exported directly or indirectly, into any + * country prohibited by the United States Export Administration Act and the + * regulations thereunder, without the required authorization from the U.S. + * government nor will be used for any purpose prohibited by the same. + * *************************************************************************** + * + */ + +#include "AGESA.h" +#include "AdvancedApi.h" +#include "mport.h" +#include "ma.h" +#include "Ids.h" +#include "cpuFamRegisters.h" +#include "cpuRegisters.h" +#include "mm.h" +#include "mn.h" +#include "mp.h" +#include "mu.h" +#include "OptionMemory.h" +#include "PlatformMemoryConfiguration.h" +#include "Filecode.h" +CODE_GROUP (G2_PEI) +RDATA_GROUP (G2_PEI) + +#define FILECODE PROC_MEM_PS_TN_FP2_MPSTNFP2_FILECODE +/*---------------------------------------------------------------------------- + * DEFINITIONS AND MACROS + * + *---------------------------------------------------------------------------- + */ +#define SOCKET_FP2_TN 0 + +/*---------------------------------------------------------------------------- + * TYPEDEFS AND STRUCTURES + * + *---------------------------------------------------------------------------- + */ + +/*---------------------------------------------------------------------------- + * PROTOTYPES OF LOCAL FUNCTIONS + * + *---------------------------------------------------------------------------- + */ +/* + *----------------------------------------------------------------------------- + * EXPORTED FUNCTIONS + * + *----------------------------------------------------------------------------- + */ +// Slow mode, Address timing and Output drive compensation for soldered down SODIMM configuration +// Format : +// DimmPerCh, DDRrate, VDDIO, Dimm0, Dimm1, Dimm2, SlowMode, AddTmgCtl, ODC +// +STATIC CONST PSCFG_SAO_ENTRY TNSODWNSODdr3SAO[] = { + {_DIMM_NONE, DDR667 + DDR800, VOLT_ALL, DIMM_SR + DIMM_DR, NP, NP, 0, 0x00000000, 0x00002222}, + {_DIMM_NONE, DDR1066, VOLT_ALL, DIMM_SR, NP, NP, 0, 0x003D3D3D, 0x10002222}, + {_DIMM_NONE, DDR1066, VOLT_ALL, DIMM_DR, NP, NP, 0, 0x00000000, 0x10002222}, + {_DIMM_NONE, DDR1333, VOLT_ALL, DIMM_SR, NP, NP, 0, 0x003D3D3D, 0x20002222}, + {_DIMM_NONE, DDR1333, VOLT_ALL, DIMM_DR, NP, NP, 0, 0x00003D3D, 0x20002222}, +}; +CONST PSC_TBL_ENTRY TNSAOTblEntSODWNSO3 = { + {PSCFG_SAO, SODWN_SODIMM_TYPE, _DIMM_NONE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY}, + sizeof (TNSODWNSODdr3SAO) / sizeof (PSCFG_SAO_ENTRY), + (VOID *)&TNSODWNSODdr3SAO +}; + +// Dram Term and Dynamic Dram Term for soldered down SODIMM configuration +// Format : +// DimmPerCh, DDRrate, VDDIO, Dimm0, Dimm1, Dimm2, Dimm, Rank, RttNom, RttWr +// +// RttNom: +// 0 On die termination disabled +// 1 60ohms +// 2 120ohms +// 3 40ohms +// 4 20ohms +// 5 30ohms +// RttWr: +// 0 Dynamic termination for writes disabled. +// 1 60ohms +// 2 120ohms +STATIC CONST PSCFG_RTT_ENTRY DramTermTNSODWNSODIMM[] = { + {_DIMM_NONE, DDR667 + DDR800 + DDR1066, VOLT_ALL, DIMM_SR + DIMM_DR, NP, NP, DIMM_SR + DIMM_DR, R0 + R1, 2, 0}, + {_DIMM_NONE, DDR1333, VOLT_ALL, DIMM_SR + DIMM_DR, NP, NP, DIMM_SR + DIMM_DR, R0 + R1, 1, 0}, +}; +CONST PSC_TBL_ENTRY TNDramTermTblEntSODWNSO = { + {PSCFG_RTT, SODWN_SODIMM_TYPE, _DIMM_NONE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY}, + sizeof (DramTermTNSODWNSODIMM) / sizeof (PSCFG_RTT_ENTRY), + (VOID *)&DramTermTNSODWNSODIMM +}; + +// Max Freq. for soldered down SODIMM configuration +// Format : +// DimmPerCh, Dimms, SR, DR, QR, Speed1_5V, Speed1_35V, Speed1_25V +// +STATIC CONST PSCFG_MAXFREQ_ENTRY ROMDATA MaxFreqTNSODWNSODIMM[] = { +}; +CONST PSC_TBL_ENTRY TNMaxFreqTblEntSODWNSO = { + {PSCFG_MAXFREQ, SODWN_SODIMM_TYPE, _DIMM_NONE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY}, + sizeof (MaxFreqTNSODWNSODIMM) / sizeof (PSCFG_MAXFREQ_ENTRY), + (VOID *)&MaxFreqTNSODWNSODIMM +}; + +// +// MemClkDis +// +STATIC CONST UINT8 ROMDATA TNSODdr3CLKDisFP2[] = {0xFF, 0xFF, 0xFF, 0xFF, 0x00, 0x00, 0x00, 0x00}; +CONST PSC_TBL_ENTRY TNClkDisMapEntSOFP2 = { + {PSCFG_CLKDIS, SODIMM_TYPE + UDIMM_TYPE, _1DIMM + _2DIMM, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, SOCKET_FP2_TN, DDR3_TECHNOLOGY}, + sizeof (TNSODdr3CLKDisFP2) / sizeof (UINT8), + (VOID *)&TNSODdr3CLKDisFP2 +}; + +// +// ODT tri-state +// +STATIC CONST UINT8 ROMDATA TNSODdr3ODTTriFP2[] = {0xFF, 0xFF, 0xFF, 0xFF}; +CONST PSC_TBL_ENTRY TNSODdr3ODTTriEntFP2 = { + {PSCFG_ODTTRI, SODIMM_TYPE + UDIMM_TYPE, _1DIMM + _2DIMM, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, SOCKET_FP2_TN, DDR3_TECHNOLOGY}, + sizeof (TNSODdr3ODTTriFP2) / sizeof (UINT8), + (VOID *)&TNSODdr3ODTTriFP2 +}; + +// +// ChipSel tri-state +// +STATIC CONST UINT8 ROMDATA TNSODdr3CSTriFP2[] = {0xFF, 0xFF, 0xFF, 0xFF, 0x00, 0x00, 0x00, 0x00}; +CONST PSC_TBL_ENTRY TNSODdr3CSTriEntFP2 = { + {PSCFG_CSTRI, SODIMM_TYPE + UDIMM_TYPE, _1DIMM + _2DIMM, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, SOCKET_FP2_TN, DDR3_TECHNOLOGY}, + sizeof (TNSODdr3CSTriFP2) / sizeof (UINT8), + (VOID *)&TNSODdr3CSTriFP2 +}; |