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-rw-r--r--src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FM2/mpUtnfm2.c153
-rw-r--r--src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FP2/mpStnfp2.c196
-rw-r--r--src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FS1/mpStnfs1.c142
-rw-r--r--src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/mpStn3.c203
-rw-r--r--src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/mpUtn3.c205
-rw-r--r--src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/mptn3.c186
6 files changed, 1085 insertions, 0 deletions
diff --git a/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FM2/mpUtnfm2.c b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FM2/mpUtnfm2.c
new file mode 100644
index 0000000000..09880798e9
--- /dev/null
+++ b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FM2/mpUtnfm2.c
@@ -0,0 +1,153 @@
+/* $NoKeywords:$ */
+/**
+ * @file
+ *
+ * mpUtnfm2.c
+ *
+ * Platform specific settings for TN DDR3 UDIMM FM2 system
+ *
+ * @xrefitem bom "File Content Label" "Release Content"
+ * @e project: AGESA
+ * @e sub-project: (Mem/Ps/TN/FM2)
+ * @e \$Revision: 63425 $ @e \$Date: 2011-12-22 11:24:10 -0600 (Thu, 22 Dec 2011) $
+ *
+ **/
+/*****************************************************************************
+ *
+ * Copyright 2008 - 2012 ADVANCED MICRO DEVICES, INC. All Rights Reserved.
+ *
+ * AMD is granting you permission to use this software (the Materials)
+ * pursuant to the terms and conditions of your Software License Agreement
+ * with AMD. This header does *NOT* give you permission to use the Materials
+ * or any rights under AMD's intellectual property. Your use of any portion
+ * of these Materials shall constitute your acceptance of those terms and
+ * conditions. If you do not agree to the terms and conditions of the Software
+ * License Agreement, please do not use any portion of these Materials.
+ *
+ * CONFIDENTIALITY: The Materials and all other information, identified as
+ * confidential and provided to you by AMD shall be kept confidential in
+ * accordance with the terms and conditions of the Software License Agreement.
+ *
+ * LIMITATION OF LIABILITY: THE MATERIALS AND ANY OTHER RELATED INFORMATION
+ * PROVIDED TO YOU BY AMD ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED
+ * WARRANTY OF ANY KIND, INCLUDING BUT NOT LIMITED TO WARRANTIES OF
+ * MERCHANTABILITY, NONINFRINGEMENT, TITLE, FITNESS FOR ANY PARTICULAR PURPOSE,
+ * OR WARRANTIES ARISING FROM CONDUCT, COURSE OF DEALING, OR USAGE OF TRADE.
+ * IN NO EVENT SHALL AMD OR ITS LICENSORS BE LIABLE FOR ANY DAMAGES WHATSOEVER
+ * (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS
+ * INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF AMD'S NEGLIGENCE,
+ * GROSS NEGLIGENCE, THE USE OF OR INABILITY TO USE THE MATERIALS OR ANY OTHER
+ * RELATED INFORMATION PROVIDED TO YOU BY AMD, EVEN IF AMD HAS BEEN ADVISED OF
+ * THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE
+ * EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES,
+ * THE ABOVE LIMITATION MAY NOT APPLY TO YOU.
+ *
+ * AMD does not assume any responsibility for any errors which may appear in
+ * the Materials or any other related information provided to you by AMD, or
+ * result from use of the Materials or any related information.
+ *
+ * You agree that you will not reverse engineer or decompile the Materials.
+ *
+ * NO SUPPORT OBLIGATION: AMD is not obligated to furnish, support, or make any
+ * further information, software, technical information, know-how, or show-how
+ * available to you. Additionally, AMD retains the right to modify the
+ * Materials at any time, without notice, and is not obligated to provide such
+ * modified Materials to you.
+ *
+ * U.S. GOVERNMENT RESTRICTED RIGHTS: The Materials are provided with
+ * "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is
+ * subject to the restrictions as set forth in FAR 52.227-14 and
+ * DFAR252.227-7013, et seq., or its successor. Use of the Materials by the
+ * Government constitutes acknowledgement of AMD's proprietary rights in them.
+ *
+ * EXPORT ASSURANCE: You agree and certify that neither the Materials, nor any
+ * direct product thereof will be exported directly or indirectly, into any
+ * country prohibited by the United States Export Administration Act and the
+ * regulations thereunder, without the required authorization from the U.S.
+ * government nor will be used for any purpose prohibited by the same.
+ * ***************************************************************************
+ *
+ */
+
+#include "AGESA.h"
+#include "AdvancedApi.h"
+#include "mport.h"
+#include "ma.h"
+#include "Ids.h"
+#include "cpuFamRegisters.h"
+#include "cpuRegisters.h"
+#include "mm.h"
+#include "mn.h"
+#include "mp.h"
+#include "mu.h"
+#include "OptionMemory.h"
+#include "PlatformMemoryConfiguration.h"
+#include "Filecode.h"
+CODE_GROUP (G2_PEI)
+RDATA_GROUP (G2_PEI)
+
+#define FILECODE PROC_MEM_PS_TN_FM2_MPUTNFM2_FILECODE
+/*----------------------------------------------------------------------------
+ * DEFINITIONS AND MACROS
+ *
+ *----------------------------------------------------------------------------
+ */
+#define SOCKET_FM2_TN 2
+
+/*----------------------------------------------------------------------------
+ * TYPEDEFS AND STRUCTURES
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * PROTOTYPES OF LOCAL FUNCTIONS
+ *
+ *----------------------------------------------------------------------------
+ */
+/*
+ *-----------------------------------------------------------------------------
+ * EXPORTED FUNCTIONS
+ *
+ *-----------------------------------------------------------------------------
+ */
+//
+// MemClkDis
+//
+STATIC CONST UINT8 ROMDATA TNUDdr3CLKDisFM2[] = {0xFF, 0xFF, 0xFF, 0xFF, 0x00, 0x00, 0x00, 0x00};
+CONST PSC_TBL_ENTRY TNClkDisMapEntUFM2 = {
+ {PSCFG_CLKDIS, UDIMM_TYPE + SODIMM_TYPE, _1DIMM + _2DIMM, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, SOCKET_FM2_TN, DDR3_TECHNOLOGY},
+ sizeof (TNUDdr3CLKDisFM2) / sizeof (UINT8),
+ (VOID *)&TNUDdr3CLKDisFM2
+};
+
+//
+// ODT tri-state
+//
+STATIC CONST UINT8 ROMDATA TNUDdr3ODTTriFM2[] = {0xFF, 0xFF, 0xFF, 0xFF};
+CONST PSC_TBL_ENTRY TNUDdr3ODTTriEntFM2 = {
+ {PSCFG_ODTTRI, UDIMM_TYPE + SODIMM_TYPE, _1DIMM + _2DIMM, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, SOCKET_FM2_TN, DDR3_TECHNOLOGY},
+ sizeof (TNUDdr3ODTTriFM2) / sizeof (UINT8),
+ (VOID *)&TNUDdr3ODTTriFM2
+};
+
+//
+// ChipSel tri-state [UDIMM]
+//
+STATIC CONST UINT8 ROMDATA TNUDdr3CSTriFM2[] = {0xFF, 0xFF, 0xFF, 0xFF, 0x00, 0x00, 0x00, 0x00};
+CONST PSC_TBL_ENTRY TNUDdr3CSTriEntFM2 = {
+ {PSCFG_CSTRI, UDIMM_TYPE + SODIMM_TYPE, _1DIMM + _2DIMM, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, SOCKET_FM2_TN, DDR3_TECHNOLOGY},
+ sizeof (TNUDdr3CSTriFM2) / sizeof (UINT8),
+ (VOID *)&TNUDdr3CSTriFM2
+};
+
+STATIC CONST PSCFG_S2D_ENTRY ex891_0 [] = {
+ // DimmPerCh,Frequency,VDDIO,DIMM0,DIMM1,DIMM2,Enable2DTraining
+ {1, DDR1333 + DDR1600 + DDR1866 + DDR2133, VOLT_ALL, DIMM_SR + DIMM_DR, NP, NP, 1},
+ {2, DDR1333 + DDR1600 + DDR1866 + DDR2133, VOLT_ALL, NP + DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, 1}
+ };
+CONST PSC_TBL_ENTRY ex891_1 = {
+ {PSCFG_S2D, UDIMM_TYPE + SODIMM_TYPE, NOD_DONT_CARE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, SOCKET_FM2_TN, DDR3_TECHNOLOGY},
+ sizeof (ex891_0 ) / sizeof (PSCFG_S2D_ENTRY),
+ (VOID *)&ex891_0
+};
diff --git a/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FP2/mpStnfp2.c b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FP2/mpStnfp2.c
new file mode 100644
index 0000000000..51a4421d80
--- /dev/null
+++ b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FP2/mpStnfp2.c
@@ -0,0 +1,196 @@
+/* $NoKeywords:$ */
+/**
+ * @file
+ *
+ * mpStnfp2.c
+ *
+ * Platform specific settings for TN DDR3 SO-DIMM FP2 system
+ *
+ * @xrefitem bom "File Content Label" "Release Content"
+ * @e project: AGESA
+ * @e sub-project: (Mem/Ps/TN/FP2)
+ * @e \$Revision: 63425 $ @e \$Date: 2011-12-22 11:24:10 -0600 (Thu, 22 Dec 2011) $
+ *
+ **/
+/*****************************************************************************
+ *
+ * Copyright 2008 - 2012 ADVANCED MICRO DEVICES, INC. All Rights Reserved.
+ *
+ * AMD is granting you permission to use this software (the Materials)
+ * pursuant to the terms and conditions of your Software License Agreement
+ * with AMD. This header does *NOT* give you permission to use the Materials
+ * or any rights under AMD's intellectual property. Your use of any portion
+ * of these Materials shall constitute your acceptance of those terms and
+ * conditions. If you do not agree to the terms and conditions of the Software
+ * License Agreement, please do not use any portion of these Materials.
+ *
+ * CONFIDENTIALITY: The Materials and all other information, identified as
+ * confidential and provided to you by AMD shall be kept confidential in
+ * accordance with the terms and conditions of the Software License Agreement.
+ *
+ * LIMITATION OF LIABILITY: THE MATERIALS AND ANY OTHER RELATED INFORMATION
+ * PROVIDED TO YOU BY AMD ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED
+ * WARRANTY OF ANY KIND, INCLUDING BUT NOT LIMITED TO WARRANTIES OF
+ * MERCHANTABILITY, NONINFRINGEMENT, TITLE, FITNESS FOR ANY PARTICULAR PURPOSE,
+ * OR WARRANTIES ARISING FROM CONDUCT, COURSE OF DEALING, OR USAGE OF TRADE.
+ * IN NO EVENT SHALL AMD OR ITS LICENSORS BE LIABLE FOR ANY DAMAGES WHATSOEVER
+ * (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS
+ * INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF AMD'S NEGLIGENCE,
+ * GROSS NEGLIGENCE, THE USE OF OR INABILITY TO USE THE MATERIALS OR ANY OTHER
+ * RELATED INFORMATION PROVIDED TO YOU BY AMD, EVEN IF AMD HAS BEEN ADVISED OF
+ * THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE
+ * EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES,
+ * THE ABOVE LIMITATION MAY NOT APPLY TO YOU.
+ *
+ * AMD does not assume any responsibility for any errors which may appear in
+ * the Materials or any other related information provided to you by AMD, or
+ * result from use of the Materials or any related information.
+ *
+ * You agree that you will not reverse engineer or decompile the Materials.
+ *
+ * NO SUPPORT OBLIGATION: AMD is not obligated to furnish, support, or make any
+ * further information, software, technical information, know-how, or show-how
+ * available to you. Additionally, AMD retains the right to modify the
+ * Materials at any time, without notice, and is not obligated to provide such
+ * modified Materials to you.
+ *
+ * U.S. GOVERNMENT RESTRICTED RIGHTS: The Materials are provided with
+ * "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is
+ * subject to the restrictions as set forth in FAR 52.227-14 and
+ * DFAR252.227-7013, et seq., or its successor. Use of the Materials by the
+ * Government constitutes acknowledgement of AMD's proprietary rights in them.
+ *
+ * EXPORT ASSURANCE: You agree and certify that neither the Materials, nor any
+ * direct product thereof will be exported directly or indirectly, into any
+ * country prohibited by the United States Export Administration Act and the
+ * regulations thereunder, without the required authorization from the U.S.
+ * government nor will be used for any purpose prohibited by the same.
+ * ***************************************************************************
+ *
+ */
+
+#include "AGESA.h"
+#include "AdvancedApi.h"
+#include "mport.h"
+#include "ma.h"
+#include "Ids.h"
+#include "cpuFamRegisters.h"
+#include "cpuRegisters.h"
+#include "mm.h"
+#include "mn.h"
+#include "mp.h"
+#include "mu.h"
+#include "OptionMemory.h"
+#include "PlatformMemoryConfiguration.h"
+#include "Filecode.h"
+CODE_GROUP (G2_PEI)
+RDATA_GROUP (G2_PEI)
+
+#define FILECODE PROC_MEM_PS_TN_FP2_MPSTNFP2_FILECODE
+/*----------------------------------------------------------------------------
+ * DEFINITIONS AND MACROS
+ *
+ *----------------------------------------------------------------------------
+ */
+#define SOCKET_FP2_TN 0
+
+/*----------------------------------------------------------------------------
+ * TYPEDEFS AND STRUCTURES
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * PROTOTYPES OF LOCAL FUNCTIONS
+ *
+ *----------------------------------------------------------------------------
+ */
+/*
+ *-----------------------------------------------------------------------------
+ * EXPORTED FUNCTIONS
+ *
+ *-----------------------------------------------------------------------------
+ */
+// Slow mode, Address timing and Output drive compensation for soldered down SODIMM configuration
+// Format :
+// DimmPerCh, DDRrate, VDDIO, Dimm0, Dimm1, Dimm2, SlowMode, AddTmgCtl, ODC
+//
+STATIC CONST PSCFG_SAO_ENTRY TNSODWNSODdr3SAO[] = {
+ {_DIMM_NONE, DDR667 + DDR800, VOLT_ALL, DIMM_SR + DIMM_DR, NP, NP, 0, 0x00000000, 0x00002222},
+ {_DIMM_NONE, DDR1066, VOLT_ALL, DIMM_SR, NP, NP, 0, 0x003D3D3D, 0x10002222},
+ {_DIMM_NONE, DDR1066, VOLT_ALL, DIMM_DR, NP, NP, 0, 0x00000000, 0x10002222},
+ {_DIMM_NONE, DDR1333, VOLT_ALL, DIMM_SR, NP, NP, 0, 0x003D3D3D, 0x20002222},
+ {_DIMM_NONE, DDR1333, VOLT_ALL, DIMM_DR, NP, NP, 0, 0x00003D3D, 0x20002222},
+};
+CONST PSC_TBL_ENTRY TNSAOTblEntSODWNSO3 = {
+ {PSCFG_SAO, SODWN_SODIMM_TYPE, _DIMM_NONE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY},
+ sizeof (TNSODWNSODdr3SAO) / sizeof (PSCFG_SAO_ENTRY),
+ (VOID *)&TNSODWNSODdr3SAO
+};
+
+// Dram Term and Dynamic Dram Term for soldered down SODIMM configuration
+// Format :
+// DimmPerCh, DDRrate, VDDIO, Dimm0, Dimm1, Dimm2, Dimm, Rank, RttNom, RttWr
+//
+// RttNom:
+// 0 On die termination disabled
+// 1 60ohms
+// 2 120ohms
+// 3 40ohms
+// 4 20ohms
+// 5 30ohms
+// RttWr:
+// 0 Dynamic termination for writes disabled.
+// 1 60ohms
+// 2 120ohms
+STATIC CONST PSCFG_RTT_ENTRY DramTermTNSODWNSODIMM[] = {
+ {_DIMM_NONE, DDR667 + DDR800 + DDR1066, VOLT_ALL, DIMM_SR + DIMM_DR, NP, NP, DIMM_SR + DIMM_DR, R0 + R1, 2, 0},
+ {_DIMM_NONE, DDR1333, VOLT_ALL, DIMM_SR + DIMM_DR, NP, NP, DIMM_SR + DIMM_DR, R0 + R1, 1, 0},
+};
+CONST PSC_TBL_ENTRY TNDramTermTblEntSODWNSO = {
+ {PSCFG_RTT, SODWN_SODIMM_TYPE, _DIMM_NONE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY},
+ sizeof (DramTermTNSODWNSODIMM) / sizeof (PSCFG_RTT_ENTRY),
+ (VOID *)&DramTermTNSODWNSODIMM
+};
+
+// Max Freq. for soldered down SODIMM configuration
+// Format :
+// DimmPerCh, Dimms, SR, DR, QR, Speed1_5V, Speed1_35V, Speed1_25V
+//
+STATIC CONST PSCFG_MAXFREQ_ENTRY ROMDATA MaxFreqTNSODWNSODIMM[] = {
+};
+CONST PSC_TBL_ENTRY TNMaxFreqTblEntSODWNSO = {
+ {PSCFG_MAXFREQ, SODWN_SODIMM_TYPE, _DIMM_NONE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY},
+ sizeof (MaxFreqTNSODWNSODIMM) / sizeof (PSCFG_MAXFREQ_ENTRY),
+ (VOID *)&MaxFreqTNSODWNSODIMM
+};
+
+//
+// MemClkDis
+//
+STATIC CONST UINT8 ROMDATA TNSODdr3CLKDisFP2[] = {0xFF, 0xFF, 0xFF, 0xFF, 0x00, 0x00, 0x00, 0x00};
+CONST PSC_TBL_ENTRY TNClkDisMapEntSOFP2 = {
+ {PSCFG_CLKDIS, SODIMM_TYPE + UDIMM_TYPE, _1DIMM + _2DIMM, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, SOCKET_FP2_TN, DDR3_TECHNOLOGY},
+ sizeof (TNSODdr3CLKDisFP2) / sizeof (UINT8),
+ (VOID *)&TNSODdr3CLKDisFP2
+};
+
+//
+// ODT tri-state
+//
+STATIC CONST UINT8 ROMDATA TNSODdr3ODTTriFP2[] = {0xFF, 0xFF, 0xFF, 0xFF};
+CONST PSC_TBL_ENTRY TNSODdr3ODTTriEntFP2 = {
+ {PSCFG_ODTTRI, SODIMM_TYPE + UDIMM_TYPE, _1DIMM + _2DIMM, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, SOCKET_FP2_TN, DDR3_TECHNOLOGY},
+ sizeof (TNSODdr3ODTTriFP2) / sizeof (UINT8),
+ (VOID *)&TNSODdr3ODTTriFP2
+};
+
+//
+// ChipSel tri-state
+//
+STATIC CONST UINT8 ROMDATA TNSODdr3CSTriFP2[] = {0xFF, 0xFF, 0xFF, 0xFF, 0x00, 0x00, 0x00, 0x00};
+CONST PSC_TBL_ENTRY TNSODdr3CSTriEntFP2 = {
+ {PSCFG_CSTRI, SODIMM_TYPE + UDIMM_TYPE, _1DIMM + _2DIMM, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, SOCKET_FP2_TN, DDR3_TECHNOLOGY},
+ sizeof (TNSODdr3CSTriFP2) / sizeof (UINT8),
+ (VOID *)&TNSODdr3CSTriFP2
+};
diff --git a/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FS1/mpStnfs1.c b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FS1/mpStnfs1.c
new file mode 100644
index 0000000000..cd8a60d392
--- /dev/null
+++ b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/FS1/mpStnfs1.c
@@ -0,0 +1,142 @@
+/* $NoKeywords:$ */
+/**
+ * @file
+ *
+ * mpStnfS1.c
+ *
+ * Platform specific settings for TN DDR3 SO-DIMM FS1 system
+ *
+ * @xrefitem bom "File Content Label" "Release Content"
+ * @e project: AGESA
+ * @e sub-project: (Mem/Ps/TN/FS1)
+ * @e \$Revision: 63425 $ @e \$Date: 2011-12-22 11:24:10 -0600 (Thu, 22 Dec 2011) $
+ *
+ **/
+/*****************************************************************************
+ *
+ * Copyright 2008 - 2012 ADVANCED MICRO DEVICES, INC. All Rights Reserved.
+ *
+ * AMD is granting you permission to use this software (the Materials)
+ * pursuant to the terms and conditions of your Software License Agreement
+ * with AMD. This header does *NOT* give you permission to use the Materials
+ * or any rights under AMD's intellectual property. Your use of any portion
+ * of these Materials shall constitute your acceptance of those terms and
+ * conditions. If you do not agree to the terms and conditions of the Software
+ * License Agreement, please do not use any portion of these Materials.
+ *
+ * CONFIDENTIALITY: The Materials and all other information, identified as
+ * confidential and provided to you by AMD shall be kept confidential in
+ * accordance with the terms and conditions of the Software License Agreement.
+ *
+ * LIMITATION OF LIABILITY: THE MATERIALS AND ANY OTHER RELATED INFORMATION
+ * PROVIDED TO YOU BY AMD ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED
+ * WARRANTY OF ANY KIND, INCLUDING BUT NOT LIMITED TO WARRANTIES OF
+ * MERCHANTABILITY, NONINFRINGEMENT, TITLE, FITNESS FOR ANY PARTICULAR PURPOSE,
+ * OR WARRANTIES ARISING FROM CONDUCT, COURSE OF DEALING, OR USAGE OF TRADE.
+ * IN NO EVENT SHALL AMD OR ITS LICENSORS BE LIABLE FOR ANY DAMAGES WHATSOEVER
+ * (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS
+ * INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF AMD'S NEGLIGENCE,
+ * GROSS NEGLIGENCE, THE USE OF OR INABILITY TO USE THE MATERIALS OR ANY OTHER
+ * RELATED INFORMATION PROVIDED TO YOU BY AMD, EVEN IF AMD HAS BEEN ADVISED OF
+ * THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE
+ * EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES,
+ * THE ABOVE LIMITATION MAY NOT APPLY TO YOU.
+ *
+ * AMD does not assume any responsibility for any errors which may appear in
+ * the Materials or any other related information provided to you by AMD, or
+ * result from use of the Materials or any related information.
+ *
+ * You agree that you will not reverse engineer or decompile the Materials.
+ *
+ * NO SUPPORT OBLIGATION: AMD is not obligated to furnish, support, or make any
+ * further information, software, technical information, know-how, or show-how
+ * available to you. Additionally, AMD retains the right to modify the
+ * Materials at any time, without notice, and is not obligated to provide such
+ * modified Materials to you.
+ *
+ * U.S. GOVERNMENT RESTRICTED RIGHTS: The Materials are provided with
+ * "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is
+ * subject to the restrictions as set forth in FAR 52.227-14 and
+ * DFAR252.227-7013, et seq., or its successor. Use of the Materials by the
+ * Government constitutes acknowledgement of AMD's proprietary rights in them.
+ *
+ * EXPORT ASSURANCE: You agree and certify that neither the Materials, nor any
+ * direct product thereof will be exported directly or indirectly, into any
+ * country prohibited by the United States Export Administration Act and the
+ * regulations thereunder, without the required authorization from the U.S.
+ * government nor will be used for any purpose prohibited by the same.
+ * ***************************************************************************
+ *
+ */
+
+#include "AGESA.h"
+#include "AdvancedApi.h"
+#include "mport.h"
+#include "ma.h"
+#include "Ids.h"
+#include "cpuFamRegisters.h"
+#include "cpuRegisters.h"
+#include "mm.h"
+#include "mn.h"
+#include "mp.h"
+#include "mu.h"
+#include "OptionMemory.h"
+#include "PlatformMemoryConfiguration.h"
+#include "Filecode.h"
+CODE_GROUP (G2_PEI)
+RDATA_GROUP (G2_PEI)
+
+#define FILECODE PROC_MEM_PS_TN_FS1_MPSTNFS1_FILECODE
+/*----------------------------------------------------------------------------
+ * DEFINITIONS AND MACROS
+ *
+ *----------------------------------------------------------------------------
+ */
+#define SOCKET_FS1_TN 1
+
+/*----------------------------------------------------------------------------
+ * TYPEDEFS AND STRUCTURES
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * PROTOTYPES OF LOCAL FUNCTIONS
+ *
+ *----------------------------------------------------------------------------
+ */
+/*
+ *-----------------------------------------------------------------------------
+ * EXPORTED FUNCTIONS
+ *
+ *-----------------------------------------------------------------------------
+ */
+//
+// MemClkDis
+//
+STATIC CONST UINT8 ROMDATA TNSODdr3CLKDisFS1[] = {0xFF, 0xFF, 0x00 , 0x00, 0x00, 0x00, 0x00, 0x00};
+CONST PSC_TBL_ENTRY TNClkDisMapEntSOFS1 = {
+ {PSCFG_CLKDIS, SODIMM_TYPE + UDIMM_TYPE, _1DIMM, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, SOCKET_FS1_TN, DDR3_TECHNOLOGY},
+ sizeof (TNSODdr3CLKDisFS1) / sizeof (UINT8),
+ (VOID *)&TNSODdr3CLKDisFS1
+};
+
+//
+// ODT tri-state
+//
+STATIC CONST UINT8 ROMDATA TNSODdr3ODTTriFS1[] = {0xFF, 0xFF, 0x00, 0x00};
+CONST PSC_TBL_ENTRY TNSODdr3ODTTriEntFS1 = {
+ {PSCFG_ODTTRI, SODIMM_TYPE + UDIMM_TYPE, _1DIMM, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, SOCKET_FS1_TN, DDR3_TECHNOLOGY},
+ sizeof (TNSODdr3ODTTriFS1) / sizeof (UINT8),
+ (VOID *)&TNSODdr3ODTTriFS1
+};
+
+//
+// ChipSel tri-state
+//
+STATIC CONST UINT8 ROMDATA TNSODdr3CSTriFS1[] = {0xFF, 0xFF, 0x00, 0x00, 0x00, 0x00, 0x00, 0x00};
+CONST PSC_TBL_ENTRY TNSODdr3CSTriEntFS1 = {
+ {PSCFG_CSTRI, SODIMM_TYPE + UDIMM_TYPE, _1DIMM, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, SOCKET_FS1_TN, DDR3_TECHNOLOGY},
+ sizeof (TNSODdr3CSTriFS1) / sizeof (UINT8),
+ (VOID *)&TNSODdr3CSTriFS1
+}; \ No newline at end of file
diff --git a/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/mpStn3.c b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/mpStn3.c
new file mode 100644
index 0000000000..c22a527b43
--- /dev/null
+++ b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/mpStn3.c
@@ -0,0 +1,203 @@
+/* $NoKeywords:$ */
+/**
+ * @file
+ *
+ * mpStn.c
+ *
+ * Platform specific settings for TN DDR3 SO-DIMM system
+ *
+ * @xrefitem bom "File Content Label" "Release Content"
+ * @e project: AGESA
+ * @e sub-project: (Mem/Ps/TN)
+ * @e \$Revision: 63425 $ @e \$Date: 2011-12-22 11:24:10 -0600 (Thu, 22 Dec 2011) $
+ *
+ **/
+/*****************************************************************************
+ *
+ * Copyright 2008 - 2012 ADVANCED MICRO DEVICES, INC. All Rights Reserved.
+ *
+ * AMD is granting you permission to use this software (the Materials)
+ * pursuant to the terms and conditions of your Software License Agreement
+ * with AMD. This header does *NOT* give you permission to use the Materials
+ * or any rights under AMD's intellectual property. Your use of any portion
+ * of these Materials shall constitute your acceptance of those terms and
+ * conditions. If you do not agree to the terms and conditions of the Software
+ * License Agreement, please do not use any portion of these Materials.
+ *
+ * CONFIDENTIALITY: The Materials and all other information, identified as
+ * confidential and provided to you by AMD shall be kept confidential in
+ * accordance with the terms and conditions of the Software License Agreement.
+ *
+ * LIMITATION OF LIABILITY: THE MATERIALS AND ANY OTHER RELATED INFORMATION
+ * PROVIDED TO YOU BY AMD ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED
+ * WARRANTY OF ANY KIND, INCLUDING BUT NOT LIMITED TO WARRANTIES OF
+ * MERCHANTABILITY, NONINFRINGEMENT, TITLE, FITNESS FOR ANY PARTICULAR PURPOSE,
+ * OR WARRANTIES ARISING FROM CONDUCT, COURSE OF DEALING, OR USAGE OF TRADE.
+ * IN NO EVENT SHALL AMD OR ITS LICENSORS BE LIABLE FOR ANY DAMAGES WHATSOEVER
+ * (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS
+ * INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF AMD'S NEGLIGENCE,
+ * GROSS NEGLIGENCE, THE USE OF OR INABILITY TO USE THE MATERIALS OR ANY OTHER
+ * RELATED INFORMATION PROVIDED TO YOU BY AMD, EVEN IF AMD HAS BEEN ADVISED OF
+ * THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE
+ * EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES,
+ * THE ABOVE LIMITATION MAY NOT APPLY TO YOU.
+ *
+ * AMD does not assume any responsibility for any errors which may appear in
+ * the Materials or any other related information provided to you by AMD, or
+ * result from use of the Materials or any related information.
+ *
+ * You agree that you will not reverse engineer or decompile the Materials.
+ *
+ * NO SUPPORT OBLIGATION: AMD is not obligated to furnish, support, or make any
+ * further information, software, technical information, know-how, or show-how
+ * available to you. Additionally, AMD retains the right to modify the
+ * Materials at any time, without notice, and is not obligated to provide such
+ * modified Materials to you.
+ *
+ * U.S. GOVERNMENT RESTRICTED RIGHTS: The Materials are provided with
+ * "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is
+ * subject to the restrictions as set forth in FAR 52.227-14 and
+ * DFAR252.227-7013, et seq., or its successor. Use of the Materials by the
+ * Government constitutes acknowledgement of AMD's proprietary rights in them.
+ *
+ * EXPORT ASSURANCE: You agree and certify that neither the Materials, nor any
+ * direct product thereof will be exported directly or indirectly, into any
+ * country prohibited by the United States Export Administration Act and the
+ * regulations thereunder, without the required authorization from the U.S.
+ * government nor will be used for any purpose prohibited by the same.
+ * ***************************************************************************
+ *
+ */
+
+#include "AGESA.h"
+#include "AdvancedApi.h"
+#include "mport.h"
+#include "ma.h"
+#include "Ids.h"
+#include "cpuFamRegisters.h"
+#include "cpuRegisters.h"
+#include "mm.h"
+#include "mn.h"
+#include "mp.h"
+#include "mu.h"
+#include "OptionMemory.h"
+#include "PlatformMemoryConfiguration.h"
+#include "Filecode.h"
+CODE_GROUP (G2_PEI)
+RDATA_GROUP (G2_PEI)
+
+#define FILECODE PROC_MEM_PS_TN_MPSTN3_FILECODE
+/*----------------------------------------------------------------------------
+ * DEFINITIONS AND MACROS
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * TYPEDEFS AND STRUCTURES
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * PROTOTYPES OF LOCAL FUNCTIONS
+ *
+ *----------------------------------------------------------------------------
+ */
+/*
+ *-----------------------------------------------------------------------------
+ * EXPORTED FUNCTIONS
+ *
+ *-----------------------------------------------------------------------------
+ */
+// Slow mode, Address timing and Output drive compensation for normal SODIMM configuration
+// Format :
+// DimmPerCh, DDRrate, VDDIO, Dimm0, Dimm1, Dimm2, SlowMode, AddTmgCtl, ODC
+//
+STATIC CONST PSCFG_SAO_ENTRY TNSODdr3SAO[] = {
+ {_1DIMM, DDR667 + DDR800, VOLT_ALL, DIMM_SR + DIMM_DR, NP, NP, 0, 0x00000000, 0x00002222},
+ {_1DIMM, DDR1066, VOLT_ALL, DIMM_SR, NP, NP, 0, 0x003D3D3D, 0x10002222},
+ {_1DIMM, DDR1066, VOLT_ALL, DIMM_DR, NP, NP, 0, 0x00000000, 0x10002222},
+ {_1DIMM, DDR1333, VOLT_ALL, DIMM_SR, NP, NP, 0, 0x003D3D3D, 0x20002222},
+ {_1DIMM, DDR1333, VOLT_ALL, DIMM_DR, NP, NP, 0, 0x00003D3D, 0x20002222},
+ {_1DIMM, DDR1600, V1_5 + V1_35, DIMM_SR, NP, NP, 0, 0x003C3C3C, 0x30112222},
+ {_1DIMM, DDR1600, V1_5 + V1_35, DIMM_DR, NP, NP, 1, 0x00003C3C, 0x30112222},
+ {_1DIMM, DDR1866, V1_5, DIMM_SR, NP, NP, 0, 0x003C3C3C, 0x30112222},
+ {_1DIMM, DDR1866, V1_5, DIMM_DR, NP, NP, 1, 0x00003C3C, 0x30112222},
+ {_2DIMM, DDR667 + DDR800, VOLT_ALL, NP, DIMM_SR + DIMM_DR, NP, 0, 0x00000000, 0x00002222},
+ {_2DIMM, DDR667, VOLT_ALL, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, 1, 0x00000039, 0x10222323},
+ {_2DIMM, DDR800, VOLT_ALL, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, 1, 0x00000039, 0x20222323},
+ {_2DIMM, DDR1066, VOLT_ALL, NP, DIMM_SR, NP, 0, 0x003D3D3D, 0x10002222},
+ {_2DIMM, DDR1066, VOLT_ALL, NP, DIMM_DR, NP, 0, 0x00000000, 0x10002222},
+ {_2DIMM, DDR1066, VOLT_ALL, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, 1, 0x00000037, 0x30222323},
+ {_2DIMM, DDR1333, VOLT_ALL, NP, DIMM_SR, NP, 0, 0x003D3D3D, 0x20002222},
+ {_2DIMM, DDR1333, VOLT_ALL, NP, DIMM_DR, NP, 0, 0x00003D3D, 0x20002222},
+ {_2DIMM, DDR1333, VOLT_ALL, DIMM_SR, DIMM_SR, NP, 1, 0x00000035, 0x30222323},
+ {_2DIMM, DDR1333, V1_5 + V1_35, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, 1, 0x00000035, 0x30222323},
+ {_2DIMM, DDR1600, V1_5 + V1_35, NP, DIMM_SR, NP, 0, 0x003C3C3C, 0x30112222},
+ {_2DIMM, DDR1600, V1_5 + V1_35, NP, DIMM_DR, NP, 1, 0x00003C3C, 0x30112222},
+};
+CONST PSC_TBL_ENTRY TNSAOTblEntSO3 = {
+ {PSCFG_SAO, SODIMM_TYPE, NOD_DONT_CARE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY},
+ sizeof (TNSODdr3SAO) / sizeof (PSCFG_SAO_ENTRY),
+ (VOID *)&TNSODdr3SAO
+};
+
+// Dram Term and Dynamic Dram Term for normal SODIMM configuration
+// Format :
+// DimmPerCh, DDRrate, VDDIO, Dimm0, Dimm1, Dimm2, Dimm, Rank, RttNom, RttWr
+//
+// RttNom:
+// 0 On die termination disabled
+// 1 60ohms
+// 2 120ohms
+// 3 40ohms
+// 4 20ohms
+// 5 30ohms
+// RttWr:
+// 0 Dynamic termination for writes disabled.
+// 1 60ohms
+// 2 120ohms
+STATIC CONST PSCFG_RTT_ENTRY DramTermTNSODIMM[] = {
+ {_1DIMM, DDR667 + DDR800 + DDR1066, VOLT_ALL, DIMM_SR + DIMM_DR, NP, NP, DIMM_SR + DIMM_DR, R0 + R1, 2, 0},
+ {_1DIMM, DDR1333, VOLT_ALL, DIMM_SR + DIMM_DR, NP, NP, DIMM_SR + DIMM_DR, R0 + R1, 1, 0},
+ {_1DIMM, DDR1600, V1_5 + V1_35, DIMM_SR + DIMM_DR, NP, NP, DIMM_SR + DIMM_DR, R0 + R1, 3, 0},
+ {_1DIMM, DDR1866, V1_5, DIMM_SR + DIMM_DR, NP, NP, DIMM_SR + DIMM_DR, R0 + R1, 3, 0},
+ {_2DIMM, DDR667, VOLT_ALL, NP, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 2, 0},
+ {_2DIMM, DDR667, VOLT_ALL, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 3, 2},
+ {_2DIMM, DDR800, VOLT_ALL, NP, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 2, 0},
+ {_2DIMM, DDR800, VOLT_ALL, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 3, 2},
+ {_2DIMM, DDR1066, VOLT_ALL, NP, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 2, 0},
+ {_2DIMM, DDR1066, VOLT_ALL, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 5, 2},
+ {_2DIMM, DDR1333, VOLT_ALL, NP, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 1, 0},
+ {_2DIMM, DDR1333, VOLT_ALL, DIMM_SR, DIMM_SR, NP, DIMM_SR, R0, 5, 2},
+ {_2DIMM, DDR1333, V1_5 + V1_35, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 5, 2},
+ {_2DIMM, DDR1600, V1_5 + V1_35, NP, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 3, 0},
+ {_2DIMM, DDR1866, V1_5, NP, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 3, 0}
+};
+CONST PSC_TBL_ENTRY TNDramTermTblEntSO = {
+ {PSCFG_RTT, SODIMM_TYPE, NOD_DONT_CARE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY},
+ sizeof (DramTermTNSODIMM) / sizeof (PSCFG_RTT_ENTRY),
+ (VOID *)&DramTermTNSODIMM
+};
+
+// Max Freq. for normal SODIMM configuration
+// Format :
+// DimmPerCh, Dimms, SR, DR, QR, Speed1_5V, Speed1_35V, Speed1_25V
+//
+STATIC CONST PSCFG_MAXFREQ_ENTRY ROMDATA MaxFreqTNSODIMM[] = {
+ {{_1DIMM, 1, 1, 0, 0, DDR1866_FREQUENCY, DDR1600_FREQUENCY, DDR1333_FREQUENCY}},
+ {{_1DIMM, 1, 0, 1, 0, DDR1866_FREQUENCY, DDR1600_FREQUENCY, DDR1333_FREQUENCY}},
+ {{_2DIMM, 1, 1, 0, 0, DDR1600_FREQUENCY, DDR1600_FREQUENCY, DDR1333_FREQUENCY}},
+ {{_2DIMM, 1, 0, 1, 0, DDR1600_FREQUENCY, DDR1600_FREQUENCY, DDR1333_FREQUENCY}},
+ {{_2DIMM, 2, 2, 0, 0, DDR1600_FREQUENCY, DDR1333_FREQUENCY, DDR1333_FREQUENCY}},
+ {{_2DIMM, 2, 1, 1, 0, DDR1333_FREQUENCY, DDR1333_FREQUENCY, DDR1066_FREQUENCY}},
+ {{_2DIMM, 2, 0, 2, 0, DDR1333_FREQUENCY, DDR1333_FREQUENCY, DDR1066_FREQUENCY}}
+};
+CONST PSC_TBL_ENTRY TNMaxFreqTblEntSO = {
+ {PSCFG_MAXFREQ, SODIMM_TYPE, NOD_DONT_CARE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY},
+ sizeof (MaxFreqTNSODIMM) / sizeof (PSCFG_MAXFREQ_ENTRY),
+ (VOID *)&MaxFreqTNSODIMM
+};
+
+
diff --git a/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/mpUtn3.c b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/mpUtn3.c
new file mode 100644
index 0000000000..06340ed695
--- /dev/null
+++ b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/mpUtn3.c
@@ -0,0 +1,205 @@
+/* $NoKeywords:$ */
+/**
+ * @file
+ *
+ * mpUtn3.c
+ *
+ * Platform specific settings for TN DDR3 UDIMM system
+ *
+ * @xrefitem bom "File Content Label" "Release Content"
+ * @e project: AGESA
+ * @e sub-project: (Mem/Ps/TN)
+ * @e \$Revision: 63425 $ @e \$Date: 2011-12-22 11:24:10 -0600 (Thu, 22 Dec 2011) $
+ *
+ **/
+/*****************************************************************************
+ *
+ * Copyright 2008 - 2012 ADVANCED MICRO DEVICES, INC. All Rights Reserved.
+ *
+ * AMD is granting you permission to use this software (the Materials)
+ * pursuant to the terms and conditions of your Software License Agreement
+ * with AMD. This header does *NOT* give you permission to use the Materials
+ * or any rights under AMD's intellectual property. Your use of any portion
+ * of these Materials shall constitute your acceptance of those terms and
+ * conditions. If you do not agree to the terms and conditions of the Software
+ * License Agreement, please do not use any portion of these Materials.
+ *
+ * CONFIDENTIALITY: The Materials and all other information, identified as
+ * confidential and provided to you by AMD shall be kept confidential in
+ * accordance with the terms and conditions of the Software License Agreement.
+ *
+ * LIMITATION OF LIABILITY: THE MATERIALS AND ANY OTHER RELATED INFORMATION
+ * PROVIDED TO YOU BY AMD ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED
+ * WARRANTY OF ANY KIND, INCLUDING BUT NOT LIMITED TO WARRANTIES OF
+ * MERCHANTABILITY, NONINFRINGEMENT, TITLE, FITNESS FOR ANY PARTICULAR PURPOSE,
+ * OR WARRANTIES ARISING FROM CONDUCT, COURSE OF DEALING, OR USAGE OF TRADE.
+ * IN NO EVENT SHALL AMD OR ITS LICENSORS BE LIABLE FOR ANY DAMAGES WHATSOEVER
+ * (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS
+ * INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF AMD'S NEGLIGENCE,
+ * GROSS NEGLIGENCE, THE USE OF OR INABILITY TO USE THE MATERIALS OR ANY OTHER
+ * RELATED INFORMATION PROVIDED TO YOU BY AMD, EVEN IF AMD HAS BEEN ADVISED OF
+ * THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE
+ * EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES,
+ * THE ABOVE LIMITATION MAY NOT APPLY TO YOU.
+ *
+ * AMD does not assume any responsibility for any errors which may appear in
+ * the Materials or any other related information provided to you by AMD, or
+ * result from use of the Materials or any related information.
+ *
+ * You agree that you will not reverse engineer or decompile the Materials.
+ *
+ * NO SUPPORT OBLIGATION: AMD is not obligated to furnish, support, or make any
+ * further information, software, technical information, know-how, or show-how
+ * available to you. Additionally, AMD retains the right to modify the
+ * Materials at any time, without notice, and is not obligated to provide such
+ * modified Materials to you.
+ *
+ * U.S. GOVERNMENT RESTRICTED RIGHTS: The Materials are provided with
+ * "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is
+ * subject to the restrictions as set forth in FAR 52.227-14 and
+ * DFAR252.227-7013, et seq., or its successor. Use of the Materials by the
+ * Government constitutes acknowledgement of AMD's proprietary rights in them.
+ *
+ * EXPORT ASSURANCE: You agree and certify that neither the Materials, nor any
+ * direct product thereof will be exported directly or indirectly, into any
+ * country prohibited by the United States Export Administration Act and the
+ * regulations thereunder, without the required authorization from the U.S.
+ * government nor will be used for any purpose prohibited by the same.
+ * ***************************************************************************
+ *
+ */
+
+#include "AGESA.h"
+#include "AdvancedApi.h"
+#include "PlatformMemoryConfiguration.h"
+#include "mport.h"
+#include "ma.h"
+#include "Ids.h"
+#include "cpuFamRegisters.h"
+#include "cpuRegisters.h"
+#include "mm.h"
+#include "mn.h"
+#include "mp.h"
+#include "GeneralServices.h"
+#include "Filecode.h"
+CODE_GROUP (G2_PEI)
+RDATA_GROUP (G2_PEI)
+
+#define FILECODE PROC_MEM_PS_TN_MPUTN3_FILECODE
+/*----------------------------------------------------------------------------
+ * DEFINITIONS AND MACROS
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * TYPEDEFS AND STRUCTURES
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * PROTOTYPES OF LOCAL FUNCTIONS
+ *
+ *----------------------------------------------------------------------------
+ */
+/*
+ *-----------------------------------------------------------------------------
+ * EXPORTED FUNCTIONS
+ *
+ *-----------------------------------------------------------------------------
+ */
+// Slow mode, Address timing and Output drive compensation
+// Format :
+// DimmPerCh, DDRrate, VDDIO, Dimm0, Dimm1, Dimm2, SlowMode, AddTmgCtl, ODC
+//
+STATIC CONST PSCFG_SAO_ENTRY TNUDdr3SAO[] = {
+ {_1DIMM, DDR667 + DDR800, VOLT_ALL, DIMM_SR, NP, NP, 0, 0x00000000, 0x00112222},
+ {_1DIMM, DDR667 + DDR800, VOLT_ALL, DIMM_DR, NP, NP, 0, 0x003B0000, 0x00112222},
+ {_1DIMM, DDR1066, VOLT_ALL, DIMM_SR, NP, NP, 0, 0x00000000, 0x10112222},
+ {_1DIMM, DDR1066, VOLT_ALL, DIMM_DR, NP, NP, 0, 0x00380000, 0x10112222},
+ {_1DIMM, DDR1333, VOLT_ALL, DIMM_SR, NP, NP, 0, 0x00000000, 0x20112222},
+ {_1DIMM, DDR1333, VOLT_ALL, DIMM_DR, NP, NP, 0, 0x00360000, 0x20112222},
+ {_1DIMM, DDR1600, V1_5 + V1_35, DIMM_SR, NP, NP, 0, 0x00000000, 0x30112222},
+ {_1DIMM, DDR1600, V1_5 + V1_35, DIMM_DR, NP, NP, 1, 0x00000000, 0x30112222},
+ {_1DIMM, DDR1866 + DDR2133, V1_5, DIMM_SR, NP, NP, 0, 0x00000000, 0x30112222},
+ {_1DIMM, DDR1866 + DDR2133, V1_5, DIMM_DR, NP, NP, 1, 0x00000000, 0x30112222},
+ {_2DIMM, DDR667 + DDR800, VOLT_ALL, NP, DIMM_SR, NP, 0, 0x00000000, 0x00112222},
+ {_2DIMM, DDR667 + DDR800, VOLT_ALL, NP, DIMM_DR, NP, 0, 0x003B0000, 0x00112222},
+ {_2DIMM, DDR667, VOLT_ALL, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, 0, 0x00390039, 0x10222322},
+ {_2DIMM, DDR800, VOLT_ALL, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, 0, 0x00390039, 0x20222322},
+ {_2DIMM, DDR1066, VOLT_ALL, NP, DIMM_SR, NP, 0, 0x00000000, 0x10112222},
+ {_2DIMM, DDR1066, VOLT_ALL, NP, DIMM_DR, NP, 0, 0x00380000, 0x10112222},
+ {_2DIMM, DDR1066, VOLT_ALL, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, 0, 0x00350037, 0x30222322},
+ {_2DIMM, DDR1333, VOLT_ALL, NP, DIMM_SR, NP, 0, 0x00000000, 0x20112222},
+ {_2DIMM, DDR1333, VOLT_ALL, NP, DIMM_DR, NP, 0, 0x00360000, 0x20112222},
+ {_2DIMM, DDR1333, VOLT_ALL, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, 1, 0x00000035, 0x30222322},
+ {_2DIMM, DDR1600, V1_5 + V1_35, NP, DIMM_SR, NP, 0, 0x00000000, 0x30112222},
+ {_2DIMM, DDR1600, V1_5 + V1_35, NP, DIMM_DR, NP, 1, 0x00000000, 0x30112222},
+ {_2DIMM, DDR1600, V1_5 + V1_35, DIMM_SR, DIMM_SR, NP, 1, 0x0000002B, 0x30222322},
+ {_2DIMM, DDR1600, V1_5, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, 1, 0x00000033, 0x30222322},
+ {_2DIMM, DDR1866, V1_5, NP, DIMM_SR, NP, 0, 0x00000000, 0x30112222},
+ {_2DIMM, DDR1866, V1_5, NP, DIMM_DR, NP, 1, 0x00000000, 0x30112222},
+ {_2DIMM, DDR1866, V1_5, DIMM_SR, DIMM_SR, NP, 1, 0x00000031, 0x30222322},
+};
+CONST PSC_TBL_ENTRY TNSAOTblEntU3 = {
+ {PSCFG_SAO, UDIMM_TYPE, NOD_DONT_CARE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY},
+ sizeof (TNUDdr3SAO) / sizeof (PSCFG_SAO_ENTRY),
+ (VOID *)&TNUDdr3SAO
+};
+
+// Dram Term and Dynamic Dram Term
+// Format :
+// DimmPerCh, DDRrate, VDDIO, Dimm0, Dimm1, Dimm2, Dimm, Rank, RttNom, RttWr
+//
+// RttNom:
+// 0 On die termination disabled
+// 1 60ohms
+// 2 120ohms
+// 3 40ohms
+// 4 20ohms
+// 5 30ohms
+// RttWr:
+// 0 Dynamic termination for writes disabled.
+// 1 60ohms
+// 2 120ohms
+STATIC CONST PSCFG_RTT_ENTRY DramTermTNUDIMM[] = {
+ {_1DIMM, DDR667 + DDR800 + DDR1066, VOLT_ALL, DIMM_SR + DIMM_DR, NP, NP, DIMM_SR + DIMM_DR, R0 + R1, 2, 0},
+ {_1DIMM, DDR1333, VOLT_ALL, DIMM_SR + DIMM_DR, NP, NP, DIMM_SR + DIMM_DR, R0 + R1, 1, 0},
+ {_1DIMM, DDR1600, V1_5 + V1_35, DIMM_SR, NP, NP, DIMM_SR, R0, 1, 0},
+ {_1DIMM, DDR1600, V1_5 + V1_35, DIMM_DR, NP, NP, DIMM_DR, R0 + R1, 3, 0},
+ {_1DIMM, DDR1866, V1_5, DIMM_SR + DIMM_DR, NP, NP, DIMM_SR + DIMM_DR, R0 + R1, 3, 0},
+ {_1DIMM, DDR2133, V1_5, DIMM_SR + DIMM_DR, NP, NP, DIMM_SR + DIMM_DR, R0 + R1, 3, 0},
+ {_2DIMM, DDR667 + DDR800 + DDR1066, VOLT_ALL, NP, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 2, 0},
+ {_2DIMM, DDR667 + DDR800 + DDR1066, VOLT_ALL, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 3, 2},
+ {_2DIMM, DDR1333, VOLT_ALL, NP, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 1, 0},
+ {_2DIMM, DDR1333, VOLT_ALL, DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 5, 2},
+ {_2DIMM, DDR1600, V1_5 + V1_35, NP, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 3, 0},
+ {_2DIMM, DDR1600, V1_5 + V1_35, DIMM_SR, DIMM_SR, NP, DIMM_SR, R0, 4, 1},
+ {_2DIMM, DDR1866, V1_5, NP, DIMM_SR + DIMM_DR, NP, DIMM_SR + DIMM_DR, R0 + R1, 3, 0},
+ {_2DIMM, DDR1866, V1_5, DIMM_SR, DIMM_SR, NP, DIMM_SR, R0, 4, 1},
+};
+CONST PSC_TBL_ENTRY TNDramTermTblEntU = {
+ {PSCFG_RTT, UDIMM_TYPE, NOD_DONT_CARE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY},
+ sizeof (DramTermTNUDIMM) / sizeof (PSCFG_RTT_ENTRY),
+ (VOID *)&DramTermTNUDIMM
+};
+
+// Max Freq.
+// Format :
+// DimmPerCh, Dimms, SR, DR, QR, Speed1_5V, Speed1_35V, Speed1_25V
+//
+STATIC CONST PSCFG_MAXFREQ_ENTRY ROMDATA MaxFreqTNUDIMM[] = {
+ {{_1DIMM, 1, 1, 0, 0, DDR2133_FREQUENCY, DDR1600_FREQUENCY, DDR1333_FREQUENCY}},
+ {{_1DIMM, 1, 0, 1, 0, DDR2133_FREQUENCY, DDR1600_FREQUENCY, DDR1333_FREQUENCY}},
+ {{_2DIMM, 1, 1, 0, 0, DDR1866_FREQUENCY, DDR1600_FREQUENCY, DDR1333_FREQUENCY}},
+ {{_2DIMM, 1, 0, 1, 0, DDR1866_FREQUENCY, DDR1600_FREQUENCY, DDR1333_FREQUENCY}},
+ {{_2DIMM, 2, 2, 0, 0, DDR1866_FREQUENCY, DDR1600_FREQUENCY, DDR1333_FREQUENCY}},
+ {{_2DIMM, 2, 1, 1, 0, DDR1600_FREQUENCY, DDR1333_FREQUENCY, DDR1333_FREQUENCY}},
+ {{_2DIMM, 2, 0, 2, 0, DDR1600_FREQUENCY, DDR1333_FREQUENCY, DDR1333_FREQUENCY}}
+};
+CONST PSC_TBL_ENTRY TNMaxFreqTblEntU = {
+ {PSCFG_MAXFREQ, UDIMM_TYPE, NOD_DONT_CARE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY},
+ sizeof (MaxFreqTNUDIMM) / sizeof (PSCFG_MAXFREQ_ENTRY),
+ (VOID *)&MaxFreqTNUDIMM
+};
diff --git a/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/mptn3.c b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/mptn3.c
new file mode 100644
index 0000000000..2b3e4a8e0c
--- /dev/null
+++ b/src/vendorcode/amd/agesa/f15tn/Proc/Mem/Ps/TN/mptn3.c
@@ -0,0 +1,186 @@
+/* $NoKeywords:$ */
+/**
+ * @file
+ *
+ * mptn3.c
+ *
+ * Platform specific settings for TN
+ *
+ * @xrefitem bom "File Content Label" "Release Content"
+ * @e project: AGESA
+ * @e sub-project: (Mem/Ps/TN)
+ * @e \$Revision: 63425 $ @e \$Date: 2011-12-22 11:24:10 -0600 (Thu, 22 Dec 2011) $
+ *
+ **/
+/*****************************************************************************
+ *
+ * Copyright 2008 - 2012 ADVANCED MICRO DEVICES, INC. All Rights Reserved.
+ *
+ * AMD is granting you permission to use this software (the Materials)
+ * pursuant to the terms and conditions of your Software License Agreement
+ * with AMD. This header does *NOT* give you permission to use the Materials
+ * or any rights under AMD's intellectual property. Your use of any portion
+ * of these Materials shall constitute your acceptance of those terms and
+ * conditions. If you do not agree to the terms and conditions of the Software
+ * License Agreement, please do not use any portion of these Materials.
+ *
+ * CONFIDENTIALITY: The Materials and all other information, identified as
+ * confidential and provided to you by AMD shall be kept confidential in
+ * accordance with the terms and conditions of the Software License Agreement.
+ *
+ * LIMITATION OF LIABILITY: THE MATERIALS AND ANY OTHER RELATED INFORMATION
+ * PROVIDED TO YOU BY AMD ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED
+ * WARRANTY OF ANY KIND, INCLUDING BUT NOT LIMITED TO WARRANTIES OF
+ * MERCHANTABILITY, NONINFRINGEMENT, TITLE, FITNESS FOR ANY PARTICULAR PURPOSE,
+ * OR WARRANTIES ARISING FROM CONDUCT, COURSE OF DEALING, OR USAGE OF TRADE.
+ * IN NO EVENT SHALL AMD OR ITS LICENSORS BE LIABLE FOR ANY DAMAGES WHATSOEVER
+ * (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS
+ * INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF AMD'S NEGLIGENCE,
+ * GROSS NEGLIGENCE, THE USE OF OR INABILITY TO USE THE MATERIALS OR ANY OTHER
+ * RELATED INFORMATION PROVIDED TO YOU BY AMD, EVEN IF AMD HAS BEEN ADVISED OF
+ * THE POSSIBILITY OF SUCH DAMAGES. BECAUSE SOME JURISDICTIONS PROHIBIT THE
+ * EXCLUSION OR LIMITATION OF LIABILITY FOR CONSEQUENTIAL OR INCIDENTAL DAMAGES,
+ * THE ABOVE LIMITATION MAY NOT APPLY TO YOU.
+ *
+ * AMD does not assume any responsibility for any errors which may appear in
+ * the Materials or any other related information provided to you by AMD, or
+ * result from use of the Materials or any related information.
+ *
+ * You agree that you will not reverse engineer or decompile the Materials.
+ *
+ * NO SUPPORT OBLIGATION: AMD is not obligated to furnish, support, or make any
+ * further information, software, technical information, know-how, or show-how
+ * available to you. Additionally, AMD retains the right to modify the
+ * Materials at any time, without notice, and is not obligated to provide such
+ * modified Materials to you.
+ *
+ * U.S. GOVERNMENT RESTRICTED RIGHTS: The Materials are provided with
+ * "RESTRICTED RIGHTS." Use, duplication, or disclosure by the Government is
+ * subject to the restrictions as set forth in FAR 52.227-14 and
+ * DFAR252.227-7013, et seq., or its successor. Use of the Materials by the
+ * Government constitutes acknowledgement of AMD's proprietary rights in them.
+ *
+ * EXPORT ASSURANCE: You agree and certify that neither the Materials, nor any
+ * direct product thereof will be exported directly or indirectly, into any
+ * country prohibited by the United States Export Administration Act and the
+ * regulations thereunder, without the required authorization from the U.S.
+ * government nor will be used for any purpose prohibited by the same.
+ * ***************************************************************************
+ *
+ */
+
+#include "AGESA.h"
+#include "AdvancedApi.h"
+#include "mport.h"
+#include "ma.h"
+#include "Ids.h"
+#include "cpuFamRegisters.h"
+#include "cpuRegisters.h"
+#include "mm.h"
+#include "mn.h"
+#include "mp.h"
+#include "Filecode.h"
+
+CODE_GROUP (G3_DXE)
+RDATA_GROUP (G3_DXE)
+
+
+
+#define FILECODE PROC_MEM_PS_TN_MPTN3_FILECODE
+/*----------------------------------------------------------------------------
+ * DEFINITIONS AND MACROS
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * TYPEDEFS AND STRUCTURES
+ *
+ *----------------------------------------------------------------------------
+ */
+
+/*----------------------------------------------------------------------------
+ * PROTOTYPES OF LOCAL FUNCTIONS
+ *
+ *----------------------------------------------------------------------------
+ */
+/*
+ *-----------------------------------------------------------------------------
+ * EXPORTED FUNCTIONS
+ *
+ *-----------------------------------------------------------------------------
+ */
+//
+// Common tables of TN platform specific configuration
+//
+
+// MR0[WR]
+// Format :
+// D18F2x22C_dct[1:0][Twr], MR0[WR]
+//
+CONST PSCFG_MR0WR_ENTRY TNMR0WR[] = {
+ {0x10, 0},
+ {0x05, 1},
+ {0x06, 2},
+ {0x07, 3},
+ {0x08, 4},
+ {0x0A, 5},
+ {0x0C, 6},
+ {0x0E, 7}
+};
+CONST PSC_TBL_ENTRY TNMR0WrTblEntry = {
+ {PSCFG_MR0WR, DT_DONT_CARE, NOD_DONT_CARE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY},
+ sizeof (TNMR0WR) / sizeof (PSCFG_MR0WR_ENTRY),
+ (VOID *)&TNMR0WR
+};
+
+// MR0[CL]
+// Format :
+// D18F2x200_dct[1:0][Tcl], MR0[CL][3:1], MR0[CL][0]
+//
+CONST PSCFG_MR0CL_ENTRY TNMR0CL[] = {
+ {0x05, 1, 0},
+ {0x06, 2, 0},
+ {0x07, 3, 0},
+ {0x08, 4, 0},
+ {0x09, 5, 0},
+ {0x0A, 6, 0},
+ {0x0B, 7, 0},
+ {0x0C, 0, 1},
+ {0x0D, 1, 1},
+ {0x0E, 2, 1},
+ {0x0F, 3, 1},
+ {0x10, 4, 1}
+};
+CONST PSC_TBL_ENTRY TNMR0CLTblEntry = {
+ {PSCFG_MR0CL, DT_DONT_CARE, NOD_DONT_CARE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY},
+ sizeof (TNMR0CL) / sizeof (PSCFG_MR0CL_ENTRY),
+ (VOID *)&TNMR0CL
+};
+
+// ODT pattern
+// Format:
+// Dimm0, Dimm1 RdODTCSHigh, RdODTCSLow, WrODTCSHigh, WrODTCSLow
+//
+STATIC CONST PSCFG_2D_ODTPAT_ENTRY TNOdtPat[] = {
+ {NP, DIMM_SR, 0x00000000, 0x00000000, 0x00000000, 0x00040000},
+ {NP, DIMM_DR, 0x00000000, 0x00000000, 0x00000000, 0x08040000},
+ {DIMM_SR, NP, 0x00000000, 0x00000000, 0x00000000, 0x00000001},
+ {DIMM_DR, NP, 0x00000000, 0x00000000, 0x00000000, 0x00000201},
+ {DIMM_SR + DIMM_DR, DIMM_SR + DIMM_DR, 0x00000000, 0x01010404, 0x00000000, 0x09050605}
+};
+CONST PSC_TBL_ENTRY TNOdtPatTblEnt = {
+ {PSCFG_ODT_PAT_2D, DT_DONT_CARE, NOD_DONT_CARE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY},
+ sizeof (TNOdtPat) / sizeof (PSCFG_2D_ODTPAT_ENTRY),
+ (VOID *)&TNOdtPat
+};
+
+//
+// CKE tri-state
+//
+STATIC CONST UINT8 ROMDATA TNDdr3CKETri[] = {0xFF, 0xFF};
+CONST PSC_TBL_ENTRY TNDdr3CKETriEnt = {
+ {PSCFG_CKETRI, DT_DONT_CARE, NOD_DONT_CARE, {AMD_FAMILY_15_TN, (AMD_F15_OR_ALL | AMD_F15_TN_ALL | 0x0000000000100000ull) }, PT_DONT_CARE, DDR3_TECHNOLOGY},
+ sizeof (TNDdr3CKETri) / sizeof (UINT8),
+ (VOID *)&TNDdr3CKETri
+};