From 0be6cee817d69fa32230405bc1eb70b6505ab88a Mon Sep 17 00:00:00 2001 From: =?UTF-8?q?Micha=C5=82=20=C5=BBygowski?= Date: Tue, 26 Jun 2018 14:52:51 +0200 Subject: mb/pcengines/apu1: use generic SPD MIME-Version: 1.0 Content-Type: text/plain; charset=UTF-8 Content-Transfer-Encoding: 8bit Clean up leftovers of old SPD generation and utilize common procedure to produce SPD binary. Change-Id: I4e48817c03b4372887bc0ea14209736ae2b4e48f Signed-off-by: Michał Żygowski Reviewed-on: https://review.coreboot.org/27301 Tested-by: build bot (Jenkins) Reviewed-by: Paul Menzel Reviewed-by: Patrick Georgi --- .../pcengines/apu1/HYNIX-H5TQ2G83CFR.spd.hex | 244 -------------------- .../pcengines/apu1/HYNIX-H5TQ4G83MFR.spd.hex | 247 --------------------- src/mainboard/pcengines/apu1/Kconfig | 1 + src/mainboard/pcengines/apu1/Makefile.inc | 19 +- .../pcengines/apu1/spd/HYNIX-H5TQ2G83CFR.spd.hex | 244 ++++++++++++++++++++ .../pcengines/apu1/spd/HYNIX-H5TQ4G83MFR.spd.hex | 247 +++++++++++++++++++++ 6 files changed, 494 insertions(+), 508 deletions(-) delete mode 100644 src/mainboard/pcengines/apu1/HYNIX-H5TQ2G83CFR.spd.hex delete mode 100644 src/mainboard/pcengines/apu1/HYNIX-H5TQ4G83MFR.spd.hex create mode 100644 src/mainboard/pcengines/apu1/spd/HYNIX-H5TQ2G83CFR.spd.hex create mode 100644 src/mainboard/pcengines/apu1/spd/HYNIX-H5TQ4G83MFR.spd.hex (limited to 'src') diff --git a/src/mainboard/pcengines/apu1/HYNIX-H5TQ2G83CFR.spd.hex b/src/mainboard/pcengines/apu1/HYNIX-H5TQ2G83CFR.spd.hex deleted file mode 100644 index c9138c05b3..0000000000 --- a/src/mainboard/pcengines/apu1/HYNIX-H5TQ2G83CFR.spd.hex +++ /dev/null @@ -1,244 +0,0 @@ -# -# This file is part of the coreboot project. -# -# This program is free software; you can redistribute it and/or modify -# it under the terms of the GNU General Public License as published by -# the Free Software Foundation; version 2 of the License. -# -# This program is distributed in the hope that it will be useful, -# but WITHOUT ANY WARRANTY; without even the implied warranty of -# MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the -# GNU General Public License for more details. - -# HYNIX-H5TQ2G83CFR - -# SPD contents for APU 2GB DDR3 (1333MHz PC1333) soldered down -# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage -# bits[3:0]: 1 = 128 SPD Bytes Used -# bits[6:4]: 1 = 256 SPD Bytes Total -# bit7 : 0 = CRC covers bytes 0 ~ 125 -11 - -# 1 SPD Revision - -# 0x10 = Revision 1.0 -10 -# 2 Key Byte / DRAM Device Type -# bits[7:0]: 0x0b = DDR3 SDRAM -0B - -# 3 Key Byte / Module Type -# bits[3:0]: 3 = SO-DIMM -# bits[7:4]: reserved -03 - -# 4 SDRAM CHIP Density and Banks -# bits[3:0]: 3 = 2 Gigabits Total SDRAM capacity per chip -# bits[6:4]: 0 = 3 (8 banks) -# bit7 : reserved -03 - -# 5 SDRAM Addressing -# bits[2:0]: 1 = 10 Column Address Bits -# bits[5:3]: 3 = 15 Row Address Bits -# bits[7:6]: reserved -19 - -# 6 Module Nominal Voltage, VDD -# bit0 : 0 = 1.5 V operable -# bit1 : 0 = NOT 1.35 V operable -# bit2 : 0 = NOT 1.25 V operable -# bits[7:3]: reserved -00 - -# 7 Module Organization -# bits[2:0]: 1 = 8 bits -# bits[5:3]: 0 = 1 Rank -# bits[7:6]: reserved -01 - -# 8 Module Memory Bus Width -# bits[2:0]: 3 = Primary bus width is 64 bits -# bits[4:3]: 0 = 0 bits (no bus width extension) -# bits[7:5]: reserved -03 - -# 9 Fine Timebase (FTB) Dividend / Divisor -# bits[3:0]: 0x01 divisor -# bits[7:4]: 0x01 dividend -# 1 / 1 = 1.0 ps -11 - -# 10 Medium Timebase (MTB) Dividend -# 11 Medium Timebase (MTB) Divisor -# 1 / 8 = .125 ns -01 08 - -# 12 SDRAM Minimum Cycle Time (tCKmin) -# 0x0c = tCKmin of 1.5 ns = in multiples of MTB -0C - -# 13 Reserved -00 - -# 14 CAS Latencies Supported, Least Significant Byte -# 15 CAS Latencies Supported, Most Significant Byte -# Cas Latencies of 11 - 5 are supported -7E 00 - -# 16 Minimum CAS Latency Time (tAAmin) -# 0x6C = 13.5ns - DDR3-1333 -6C - -# 17 Minimum Write Recovery Time (tWRmin) -# 0x78 = tWR of 15ns - All DDR3 speed grades -78 - -# 18 Minimum RAS# to CAS# Delay Time (tRCDmin) -# 0x6E = 13.5ns - DDR3-1333 -6C - -# 19 Minimum Row Active to Row Active Delay Time (tRRDmin) -# 0x30 = 6ns -30 - -# 20 Minimum Row Precharge Delay Time (tRPmin) -# 0x6C = 13.5ns - DDR3-1333 -6C - -# 21 Upper Nibbles for tRAS and tRC -# bits[3:0]: tRAS most significant nibble = 1 (see byte 22) -# bits[7:4]: tRC most significant nibble = 1 (see byte 23) -11 - -# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB -# 0x120 = 36ns - DDR3-1333 (see byte 21) -20 - -# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB -# 0x28C = 49.5ns - DDR3-1333 -8C - -# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB -# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB -# 0x500 = 160ns - for 2 Gigabit chips -00 05 - -# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin) -# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins -3C - -# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin) -# 0x3c = 7.5ns - All DDR3 SDRAM speed bins -3C - -# 28 Upper Nibble for tFAWmin -# 29 Minimum Four Activate Window Delay Time (tFAWmin) -# 0x00F0 = 30ns - DDR3-1333, 1 KB page size -00 F0 - -# 30 SDRAM Optional Feature -# bit0 : 1= RZQ/6 supported -# bit1 : 1 = RZQ/7 supported -# bits[6:2]: reserved -# bit7 : 1 = DLL Off mode supported -83 - -# 31 SDRAM Thermal and Refresh Options -# bit0 : 1 = Temp up to 95c supported -# bit1 : 0 = 85-95c uses 2x refresh rate -# bit2 : 1 = Auto Self Refresh supported -# bit3 : 0 = no on die thermal sensor -# bits[6:4]: reserved -# bit7 : 0 = partial self refresh supported -05 - -# 32 Module Thermal Sensor -# 0 = Thermal sensor not incorporated onto this assembly -00 - -# 33 SDRAM Device Type -# bits[1:0]: 2 = Signal Loading -# bits[3:2]: reserved -# bits[6:4]: 4 = Die count -# bit7 : 0 = Standard Monolithic DRAM Device -42 - -# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin) -# 35 Fine Offset for Minimum CAS Latency Time (tAAmin) -# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin) -# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin) -# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin) -00 00 00 00 00 - -# 39 (reserved) -00 - -# 40 - 47 (reserved) -00 00 00 00 00 00 00 00 - -# 48 - 55 (reserved) -00 00 00 00 00 00 00 00 - -# 56 - 59 (reserved) -00 00 00 00 - -# 60 Raw Card Extension, Module Nominal Height -# bits[4:0]: 0 = <= 15mm tall -# bits[7:5]: 0 = raw card revision 0-3 -00 - -# 61 Module Maximum Thickness -# bits[3:0]: 0 = thickness front <= 1mm -# bits[7:4]: 0 = thinkness back <= 1mm -00 - -# 62 Reference Raw Card Used -# bits[4:0]: 0 = Reference Raw card A used -# bits[6:5]: 0 = revision 0 -# bit7 : 0 = Reference raw cards A through AL -00 - -# 63 Address Mapping from Edge Connector to DRAM -# bit0 : 0 = standard mapping (not mirrored) -# bits[7:1]: reserved -00 - -# 64 - 71 (reserved) -00 00 00 00 00 00 00 00 - -# 72 - 79 (reserved) -00 00 00 00 00 00 00 00 - -# 80 - 87 (reserved) -00 00 00 00 00 00 00 00 - -# 88 - 95 (reserved) -00 00 00 00 00 00 00 00 - -# 96 - 103 (reserved) -00 00 00 00 00 00 00 00 - -# 104 - 111 (reserved) -00 00 00 00 00 00 00 00 - -# 112 - 116 (reserved) -00 00 00 00 00 - -# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code -# 0x0001 = AMD -00 01 - -# 119 Module ID: Module Manufacturing Location - oem specified -00 - -# 120 Module ID: Module Manufacture Year in BCD -# 0x13 = 2013 -# 121 Module ID: Module Manufacture week -# 0x12 = 12th week -13 12 - -# 122 - 125: Module Serial Number -00 00 00 00 - -# 126 - 127: Cyclical Redundancy Code -c4 1b diff --git a/src/mainboard/pcengines/apu1/HYNIX-H5TQ4G83MFR.spd.hex b/src/mainboard/pcengines/apu1/HYNIX-H5TQ4G83MFR.spd.hex deleted file mode 100644 index f091d6b294..0000000000 --- a/src/mainboard/pcengines/apu1/HYNIX-H5TQ4G83MFR.spd.hex +++ /dev/null @@ -1,247 +0,0 @@ -# -# This file is part of the coreboot project. -# -# This program is free software; you can redistribute it and/or modify -# it under the terms of the GNU General Public License as published by -# the Free Software Foundation; version 2 of the License. -# -# This program is distributed in the hope that it will be useful, -# but WITHOUT ANY WARRANTY; without even the implied warranty of -# MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the -# GNU General Public License for more details. - -# HYNIX-H5TQ4G83MFR - -# SPD contents for APU 2GB DDR3 (1333MHz PC1333) soldered down -# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage -# bits[3:0]: 1 = 128 SPD Bytes Used -# bits[6:4]: 1 = 256 SPD Bytes Total -# bit7 : 0 = CRC covers bytes 0 ~ 125 -11 - -# 1 SPD Revision - -# 0x10 = Revision 1.0 -10 -# 2 Key Byte / DRAM Device Type -# bits[7:0]: 0x0b = DDR3 SDRAM -0B - -# 3 Key Byte / Module Type -# bits[3:0]: 3 = SO-DIMM -# bits[7:4]: reserved -03 - -# 4 SDRAM CHIP Density and Banks -# bits[3:0]: 3 = 2 Gigabits Total SDRAM capacity per chip -# bits[3:0]: 4 = 4 Gigabits Total SDRAM capacity per chip -# bits[6:4]: 0 = 3 (8 banks) -# bit7 : reserved -04 - -# 5 SDRAM Addressing -# bits[2:0]: 1 = 10 Column Address Bits -# bits[5:3]: 3 = 15 Row Address Bits -# bits[5:3]: 4 = 16 Row Address Bits -# bits[7:6]: reserved -21 - -# 6 Module Nominal Voltage, VDD -# bit0 : 0 = 1.5 V operable -# bit1 : 0 = NOT 1.35 V operable -# bit2 : 0 = NOT 1.25 V operable -# bits[7:3]: reserved -00 - -# 7 Module Organization -# bits[2:0]: 1 = 8 bits -# bits[5:3]: 0 = 1 Rank -# bits[7:6]: reserved -01 - -# 8 Module Memory Bus Width -# bits[2:0]: 3 = Primary bus width is 64 bits -# bits[4:3]: 0 = 0 bits (no bus width extension) -# bits[7:5]: reserved -03 - -# 9 Fine Timebase (FTB) Dividend / Divisor -# bits[3:0]: 0x01 divisor -# bits[7:4]: 0x01 dividend -# 1 / 1 = 1.0 ps -11 - -# 10 Medium Timebase (MTB) Dividend -# 11 Medium Timebase (MTB) Divisor -# 1 / 8 = .125 ns -01 08 - -# 12 SDRAM Minimum Cycle Time (tCKmin) -# 0x0c = tCKmin of 1.5 ns = in multiples of MTB -0C - -# 13 Reserved -00 - -# 14 CAS Latencies Supported, Least Significant Byte -# 15 CAS Latencies Supported, Most Significant Byte -# Cas Latencies of 11 - 5 are supported -7E 00 - -# 16 Minimum CAS Latency Time (tAAmin) -# 0x6C = 13.5ns - DDR3-1333 -6C - -# 17 Minimum Write Recovery Time (tWRmin) -# 0x78 = tWR of 15ns - All DDR3 speed grades -78 - -# 18 Minimum RAS# to CAS# Delay Time (tRCDmin) -# 0x6E = 13.5ns - DDR3-1333 -6C - -# 19 Minimum Row Active to Row Active Delay Time (tRRDmin) -# 0x30 = 6ns -30 - -# 20 Minimum Row Precharge Delay Time (tRPmin) -# 0x6C = 13.5ns - DDR3-1333 -6C - -# 21 Upper Nibbles for tRAS and tRC -# bits[3:0]: tRAS most significant nibble = 1 (see byte 22) -# bits[7:4]: tRC most significant nibble = 1 (see byte 23) -11 - -# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB -# 0x120 = 36ns - DDR3-1333 (see byte 21) -20 - -# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB -# 0x28C = 49.5ns - DDR3-1333 -8C - -# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB -# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB -# 0x500 = 160ns - for 2 Gigabit chips -# 0x820 = 260ns - for 4 Gigabit chips -20 08 - -# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin) -# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins -3C - -# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin) -# 0x3c = 7.5ns - All DDR3 SDRAM speed bins -3C - -# 28 Upper Nibble for tFAWmin -# 29 Minimum Four Activate Window Delay Time (tFAWmin) -# 0x00F0 = 30ns - DDR3-1333, 1 KB page size -00 F0 - -# 30 SDRAM Optional Feature -# bit0 : 1= RZQ/6 supported -# bit1 : 1 = RZQ/7 supported -# bits[6:2]: reserved -# bit7 : 1 = DLL Off mode supported -83 - -# 31 SDRAM Thermal and Refresh Options -# bit0 : 1 = Temp up to 95c supported -# bit1 : 0 = 85-95c uses 2x refresh rate -# bit2 : 1 = Auto Self Refresh supported -# bit3 : 0 = no on die thermal sensor -# bits[6:4]: reserved -# bit7 : 0 = partial self refresh supported -05 - -# 32 Module Thermal Sensor -# 0 = Thermal sensor not incorporated onto this assembly -00 - -# 33 SDRAM Device Type -# bits[1:0]: 2 = Signal Loading -# bits[3:2]: reserved -# bits[6:4]: 4 = Die count -# bit7 : 0 = Standard Monolithic DRAM Device -42 - -# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin) -# 35 Fine Offset for Minimum CAS Latency Time (tAAmin) -# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin) -# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin) -# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin) -00 00 00 00 00 - -# 39 (reserved) -00 - -# 40 - 47 (reserved) -00 00 00 00 00 00 00 00 - -# 48 - 55 (reserved) -00 00 00 00 00 00 00 00 - -# 56 - 59 (reserved) -00 00 00 00 - -# 60 Raw Card Extension, Module Nominal Height -# bits[4:0]: 0 = <= 15mm tall -# bits[7:5]: 0 = raw card revision 0-3 -00 - -# 61 Module Maximum Thickness -# bits[3:0]: 0 = thickness front <= 1mm -# bits[7:4]: 0 = thinkness back <= 1mm -00 - -# 62 Reference Raw Card Used -# bits[4:0]: 0 = Reference Raw card A used -# bits[6:5]: 0 = revision 0 -# bit7 : 0 = Reference raw cards A through AL -00 - -# 63 Address Mapping from Edge Connector to DRAM -# bit0 : 0 = standard mapping (not mirrored) -# bits[7:1]: reserved -00 - -# 64 - 71 (reserved) -00 00 00 00 00 00 00 00 - -# 72 - 79 (reserved) -00 00 00 00 00 00 00 00 - -# 80 - 87 (reserved) -00 00 00 00 00 00 00 00 - -# 88 - 95 (reserved) -00 00 00 00 00 00 00 00 - -# 96 - 103 (reserved) -00 00 00 00 00 00 00 00 - -# 104 - 111 (reserved) -00 00 00 00 00 00 00 00 - -# 112 - 116 (reserved) -00 00 00 00 00 - -# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code -# 0x0001 = AMD -00 01 - -# 119 Module ID: Module Manufacturing Location - oem specified -00 - -# 120 Module ID: Module Manufacture Year in BCD -# 0x13 = 2013 -# 121 Module ID: Module Manufacture week -# 0x12 = 12th week -13 12 - -# 122 - 125: Module Serial Number -00 00 00 00 - -# 126 - 127: Cyclical Redundancy Code -7b 97 diff --git a/src/mainboard/pcengines/apu1/Kconfig b/src/mainboard/pcengines/apu1/Kconfig index 8361d8d1d8..6c98d01147 100644 --- a/src/mainboard/pcengines/apu1/Kconfig +++ b/src/mainboard/pcengines/apu1/Kconfig @@ -29,6 +29,7 @@ config BOARD_SPECIFIC_OPTIONS # dummy select HAVE_OPTION_TABLE select HAVE_CMOS_DEFAULT select BOARD_ROMSIZE_KB_2048 + select GENERIC_SPD_BIN config MAINBOARD_DIR string diff --git a/src/mainboard/pcengines/apu1/Makefile.inc b/src/mainboard/pcengines/apu1/Makefile.inc index 324e4aa365..543ac97723 100644 --- a/src/mainboard/pcengines/apu1/Makefile.inc +++ b/src/mainboard/pcengines/apu1/Makefile.inc @@ -31,22 +31,7 @@ ramstage-y += BiosCallOuts.c ramstage-y += OemCustomize.c ramstage-y += gpio_ftns.c -## DIMM SPD for on-board memory -SPD_BIN = $(obj)/spd.bin # Order of names in SPD_SOURCES is important! -SPD_SOURCES = HYNIX-H5TQ2G83CFR HYNIX-H5TQ4G83MFR - -SPD_DEPS := $(foreach f, $(SPD_SOURCES), src/mainboard/$(MAINBOARDDIR)/$(f).spd.hex) - -# Include spd ROM data -$(SPD_BIN): $(SPD_DEPS) - for f in $+; \ - do for c in $$(cat $$f | grep -v ^#); \ - do printf $$(printf '\%o' 0x$$c); \ - done; \ - done > $@ - -cbfs-files-y += spd.bin -spd.bin-file := $(SPD_BIN) -spd.bin-type := spd +SPD_SOURCES = HYNIX-H5TQ2G83CFR +SPD_SOURCES += HYNIX-H5TQ4G83MFR diff --git a/src/mainboard/pcengines/apu1/spd/HYNIX-H5TQ2G83CFR.spd.hex b/src/mainboard/pcengines/apu1/spd/HYNIX-H5TQ2G83CFR.spd.hex new file mode 100644 index 0000000000..c9138c05b3 --- /dev/null +++ b/src/mainboard/pcengines/apu1/spd/HYNIX-H5TQ2G83CFR.spd.hex @@ -0,0 +1,244 @@ +# +# This file is part of the coreboot project. +# +# This program is free software; you can redistribute it and/or modify +# it under the terms of the GNU General Public License as published by +# the Free Software Foundation; version 2 of the License. +# +# This program is distributed in the hope that it will be useful, +# but WITHOUT ANY WARRANTY; without even the implied warranty of +# MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the +# GNU General Public License for more details. + +# HYNIX-H5TQ2G83CFR + +# SPD contents for APU 2GB DDR3 (1333MHz PC1333) soldered down +# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage +# bits[3:0]: 1 = 128 SPD Bytes Used +# bits[6:4]: 1 = 256 SPD Bytes Total +# bit7 : 0 = CRC covers bytes 0 ~ 125 +11 + +# 1 SPD Revision - +# 0x10 = Revision 1.0 +10 +# 2 Key Byte / DRAM Device Type +# bits[7:0]: 0x0b = DDR3 SDRAM +0B + +# 3 Key Byte / Module Type +# bits[3:0]: 3 = SO-DIMM +# bits[7:4]: reserved +03 + +# 4 SDRAM CHIP Density and Banks +# bits[3:0]: 3 = 2 Gigabits Total SDRAM capacity per chip +# bits[6:4]: 0 = 3 (8 banks) +# bit7 : reserved +03 + +# 5 SDRAM Addressing +# bits[2:0]: 1 = 10 Column Address Bits +# bits[5:3]: 3 = 15 Row Address Bits +# bits[7:6]: reserved +19 + +# 6 Module Nominal Voltage, VDD +# bit0 : 0 = 1.5 V operable +# bit1 : 0 = NOT 1.35 V operable +# bit2 : 0 = NOT 1.25 V operable +# bits[7:3]: reserved +00 + +# 7 Module Organization +# bits[2:0]: 1 = 8 bits +# bits[5:3]: 0 = 1 Rank +# bits[7:6]: reserved +01 + +# 8 Module Memory Bus Width +# bits[2:0]: 3 = Primary bus width is 64 bits +# bits[4:3]: 0 = 0 bits (no bus width extension) +# bits[7:5]: reserved +03 + +# 9 Fine Timebase (FTB) Dividend / Divisor +# bits[3:0]: 0x01 divisor +# bits[7:4]: 0x01 dividend +# 1 / 1 = 1.0 ps +11 + +# 10 Medium Timebase (MTB) Dividend +# 11 Medium Timebase (MTB) Divisor +# 1 / 8 = .125 ns +01 08 + +# 12 SDRAM Minimum Cycle Time (tCKmin) +# 0x0c = tCKmin of 1.5 ns = in multiples of MTB +0C + +# 13 Reserved +00 + +# 14 CAS Latencies Supported, Least Significant Byte +# 15 CAS Latencies Supported, Most Significant Byte +# Cas Latencies of 11 - 5 are supported +7E 00 + +# 16 Minimum CAS Latency Time (tAAmin) +# 0x6C = 13.5ns - DDR3-1333 +6C + +# 17 Minimum Write Recovery Time (tWRmin) +# 0x78 = tWR of 15ns - All DDR3 speed grades +78 + +# 18 Minimum RAS# to CAS# Delay Time (tRCDmin) +# 0x6E = 13.5ns - DDR3-1333 +6C + +# 19 Minimum Row Active to Row Active Delay Time (tRRDmin) +# 0x30 = 6ns +30 + +# 20 Minimum Row Precharge Delay Time (tRPmin) +# 0x6C = 13.5ns - DDR3-1333 +6C + +# 21 Upper Nibbles for tRAS and tRC +# bits[3:0]: tRAS most significant nibble = 1 (see byte 22) +# bits[7:4]: tRC most significant nibble = 1 (see byte 23) +11 + +# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB +# 0x120 = 36ns - DDR3-1333 (see byte 21) +20 + +# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB +# 0x28C = 49.5ns - DDR3-1333 +8C + +# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB +# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB +# 0x500 = 160ns - for 2 Gigabit chips +00 05 + +# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin) +# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins +3C + +# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin) +# 0x3c = 7.5ns - All DDR3 SDRAM speed bins +3C + +# 28 Upper Nibble for tFAWmin +# 29 Minimum Four Activate Window Delay Time (tFAWmin) +# 0x00F0 = 30ns - DDR3-1333, 1 KB page size +00 F0 + +# 30 SDRAM Optional Feature +# bit0 : 1= RZQ/6 supported +# bit1 : 1 = RZQ/7 supported +# bits[6:2]: reserved +# bit7 : 1 = DLL Off mode supported +83 + +# 31 SDRAM Thermal and Refresh Options +# bit0 : 1 = Temp up to 95c supported +# bit1 : 0 = 85-95c uses 2x refresh rate +# bit2 : 1 = Auto Self Refresh supported +# bit3 : 0 = no on die thermal sensor +# bits[6:4]: reserved +# bit7 : 0 = partial self refresh supported +05 + +# 32 Module Thermal Sensor +# 0 = Thermal sensor not incorporated onto this assembly +00 + +# 33 SDRAM Device Type +# bits[1:0]: 2 = Signal Loading +# bits[3:2]: reserved +# bits[6:4]: 4 = Die count +# bit7 : 0 = Standard Monolithic DRAM Device +42 + +# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin) +# 35 Fine Offset for Minimum CAS Latency Time (tAAmin) +# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin) +# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin) +# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin) +00 00 00 00 00 + +# 39 (reserved) +00 + +# 40 - 47 (reserved) +00 00 00 00 00 00 00 00 + +# 48 - 55 (reserved) +00 00 00 00 00 00 00 00 + +# 56 - 59 (reserved) +00 00 00 00 + +# 60 Raw Card Extension, Module Nominal Height +# bits[4:0]: 0 = <= 15mm tall +# bits[7:5]: 0 = raw card revision 0-3 +00 + +# 61 Module Maximum Thickness +# bits[3:0]: 0 = thickness front <= 1mm +# bits[7:4]: 0 = thinkness back <= 1mm +00 + +# 62 Reference Raw Card Used +# bits[4:0]: 0 = Reference Raw card A used +# bits[6:5]: 0 = revision 0 +# bit7 : 0 = Reference raw cards A through AL +00 + +# 63 Address Mapping from Edge Connector to DRAM +# bit0 : 0 = standard mapping (not mirrored) +# bits[7:1]: reserved +00 + +# 64 - 71 (reserved) +00 00 00 00 00 00 00 00 + +# 72 - 79 (reserved) +00 00 00 00 00 00 00 00 + +# 80 - 87 (reserved) +00 00 00 00 00 00 00 00 + +# 88 - 95 (reserved) +00 00 00 00 00 00 00 00 + +# 96 - 103 (reserved) +00 00 00 00 00 00 00 00 + +# 104 - 111 (reserved) +00 00 00 00 00 00 00 00 + +# 112 - 116 (reserved) +00 00 00 00 00 + +# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code +# 0x0001 = AMD +00 01 + +# 119 Module ID: Module Manufacturing Location - oem specified +00 + +# 120 Module ID: Module Manufacture Year in BCD +# 0x13 = 2013 +# 121 Module ID: Module Manufacture week +# 0x12 = 12th week +13 12 + +# 122 - 125: Module Serial Number +00 00 00 00 + +# 126 - 127: Cyclical Redundancy Code +c4 1b diff --git a/src/mainboard/pcengines/apu1/spd/HYNIX-H5TQ4G83MFR.spd.hex b/src/mainboard/pcengines/apu1/spd/HYNIX-H5TQ4G83MFR.spd.hex new file mode 100644 index 0000000000..f091d6b294 --- /dev/null +++ b/src/mainboard/pcengines/apu1/spd/HYNIX-H5TQ4G83MFR.spd.hex @@ -0,0 +1,247 @@ +# +# This file is part of the coreboot project. +# +# This program is free software; you can redistribute it and/or modify +# it under the terms of the GNU General Public License as published by +# the Free Software Foundation; version 2 of the License. +# +# This program is distributed in the hope that it will be useful, +# but WITHOUT ANY WARRANTY; without even the implied warranty of +# MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the +# GNU General Public License for more details. + +# HYNIX-H5TQ4G83MFR + +# SPD contents for APU 2GB DDR3 (1333MHz PC1333) soldered down +# 0 Number of SPD Bytes used / Total SPD Size / CRC Coverage +# bits[3:0]: 1 = 128 SPD Bytes Used +# bits[6:4]: 1 = 256 SPD Bytes Total +# bit7 : 0 = CRC covers bytes 0 ~ 125 +11 + +# 1 SPD Revision - +# 0x10 = Revision 1.0 +10 +# 2 Key Byte / DRAM Device Type +# bits[7:0]: 0x0b = DDR3 SDRAM +0B + +# 3 Key Byte / Module Type +# bits[3:0]: 3 = SO-DIMM +# bits[7:4]: reserved +03 + +# 4 SDRAM CHIP Density and Banks +# bits[3:0]: 3 = 2 Gigabits Total SDRAM capacity per chip +# bits[3:0]: 4 = 4 Gigabits Total SDRAM capacity per chip +# bits[6:4]: 0 = 3 (8 banks) +# bit7 : reserved +04 + +# 5 SDRAM Addressing +# bits[2:0]: 1 = 10 Column Address Bits +# bits[5:3]: 3 = 15 Row Address Bits +# bits[5:3]: 4 = 16 Row Address Bits +# bits[7:6]: reserved +21 + +# 6 Module Nominal Voltage, VDD +# bit0 : 0 = 1.5 V operable +# bit1 : 0 = NOT 1.35 V operable +# bit2 : 0 = NOT 1.25 V operable +# bits[7:3]: reserved +00 + +# 7 Module Organization +# bits[2:0]: 1 = 8 bits +# bits[5:3]: 0 = 1 Rank +# bits[7:6]: reserved +01 + +# 8 Module Memory Bus Width +# bits[2:0]: 3 = Primary bus width is 64 bits +# bits[4:3]: 0 = 0 bits (no bus width extension) +# bits[7:5]: reserved +03 + +# 9 Fine Timebase (FTB) Dividend / Divisor +# bits[3:0]: 0x01 divisor +# bits[7:4]: 0x01 dividend +# 1 / 1 = 1.0 ps +11 + +# 10 Medium Timebase (MTB) Dividend +# 11 Medium Timebase (MTB) Divisor +# 1 / 8 = .125 ns +01 08 + +# 12 SDRAM Minimum Cycle Time (tCKmin) +# 0x0c = tCKmin of 1.5 ns = in multiples of MTB +0C + +# 13 Reserved +00 + +# 14 CAS Latencies Supported, Least Significant Byte +# 15 CAS Latencies Supported, Most Significant Byte +# Cas Latencies of 11 - 5 are supported +7E 00 + +# 16 Minimum CAS Latency Time (tAAmin) +# 0x6C = 13.5ns - DDR3-1333 +6C + +# 17 Minimum Write Recovery Time (tWRmin) +# 0x78 = tWR of 15ns - All DDR3 speed grades +78 + +# 18 Minimum RAS# to CAS# Delay Time (tRCDmin) +# 0x6E = 13.5ns - DDR3-1333 +6C + +# 19 Minimum Row Active to Row Active Delay Time (tRRDmin) +# 0x30 = 6ns +30 + +# 20 Minimum Row Precharge Delay Time (tRPmin) +# 0x6C = 13.5ns - DDR3-1333 +6C + +# 21 Upper Nibbles for tRAS and tRC +# bits[3:0]: tRAS most significant nibble = 1 (see byte 22) +# bits[7:4]: tRC most significant nibble = 1 (see byte 23) +11 + +# 22 Minimum Active to Precharge Delay Time (tRASmin), LSB +# 0x120 = 36ns - DDR3-1333 (see byte 21) +20 + +# 23 Minimum Active to Active/Refresh Delay Time (tRCmin), LSB +# 0x28C = 49.5ns - DDR3-1333 +8C + +# 24 Minimum Refresh Recovery Delay Time (tRFCmin), LSB +# 25 Minimum Refresh Recovery Delay Time (tRFCmin), MSB +# 0x500 = 160ns - for 2 Gigabit chips +# 0x820 = 260ns - for 4 Gigabit chips +20 08 + +# 26 Minimum Internal Write to Read Command Delay Time (tWTRmin) +# 0x3c = 7.5 ns - All DDR3 SDRAM speed bins +3C + +# 27 Minimum Internal Read to Precharge Command Delay Time (tRTPmin) +# 0x3c = 7.5ns - All DDR3 SDRAM speed bins +3C + +# 28 Upper Nibble for tFAWmin +# 29 Minimum Four Activate Window Delay Time (tFAWmin) +# 0x00F0 = 30ns - DDR3-1333, 1 KB page size +00 F0 + +# 30 SDRAM Optional Feature +# bit0 : 1= RZQ/6 supported +# bit1 : 1 = RZQ/7 supported +# bits[6:2]: reserved +# bit7 : 1 = DLL Off mode supported +83 + +# 31 SDRAM Thermal and Refresh Options +# bit0 : 1 = Temp up to 95c supported +# bit1 : 0 = 85-95c uses 2x refresh rate +# bit2 : 1 = Auto Self Refresh supported +# bit3 : 0 = no on die thermal sensor +# bits[6:4]: reserved +# bit7 : 0 = partial self refresh supported +05 + +# 32 Module Thermal Sensor +# 0 = Thermal sensor not incorporated onto this assembly +00 + +# 33 SDRAM Device Type +# bits[1:0]: 2 = Signal Loading +# bits[3:2]: reserved +# bits[6:4]: 4 = Die count +# bit7 : 0 = Standard Monolithic DRAM Device +42 + +# 34 Fine Offset for SDRAM Minimum Cycle Time (tCKmin) +# 35 Fine Offset for Minimum CAS Latency Time (tAAmin) +# 36 Fine Offset for Minimum RAS# to CAS# Delay Time (tRCDmin) +# 37 Fine Offset for Minimum Row Precharge Delay Time (tRPmin) +# 38 Fine Offset for Minimum Active to Active/Refresh Delay (tRCmin) +00 00 00 00 00 + +# 39 (reserved) +00 + +# 40 - 47 (reserved) +00 00 00 00 00 00 00 00 + +# 48 - 55 (reserved) +00 00 00 00 00 00 00 00 + +# 56 - 59 (reserved) +00 00 00 00 + +# 60 Raw Card Extension, Module Nominal Height +# bits[4:0]: 0 = <= 15mm tall +# bits[7:5]: 0 = raw card revision 0-3 +00 + +# 61 Module Maximum Thickness +# bits[3:0]: 0 = thickness front <= 1mm +# bits[7:4]: 0 = thinkness back <= 1mm +00 + +# 62 Reference Raw Card Used +# bits[4:0]: 0 = Reference Raw card A used +# bits[6:5]: 0 = revision 0 +# bit7 : 0 = Reference raw cards A through AL +00 + +# 63 Address Mapping from Edge Connector to DRAM +# bit0 : 0 = standard mapping (not mirrored) +# bits[7:1]: reserved +00 + +# 64 - 71 (reserved) +00 00 00 00 00 00 00 00 + +# 72 - 79 (reserved) +00 00 00 00 00 00 00 00 + +# 80 - 87 (reserved) +00 00 00 00 00 00 00 00 + +# 88 - 95 (reserved) +00 00 00 00 00 00 00 00 + +# 96 - 103 (reserved) +00 00 00 00 00 00 00 00 + +# 104 - 111 (reserved) +00 00 00 00 00 00 00 00 + +# 112 - 116 (reserved) +00 00 00 00 00 + +# 117 - 118 Module ID: Module Manufacturers JEDEC ID Code +# 0x0001 = AMD +00 01 + +# 119 Module ID: Module Manufacturing Location - oem specified +00 + +# 120 Module ID: Module Manufacture Year in BCD +# 0x13 = 2013 +# 121 Module ID: Module Manufacture week +# 0x12 = 12th week +13 12 + +# 122 - 125: Module Serial Number +00 00 00 00 + +# 126 - 127: Cyclical Redundancy Code +7b 97 -- cgit v1.2.3