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2017-04-27IntelFsp2Pkg: Move to new locationGuo Mang
Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Guo Mang <mang.guo@intel.com>
2016-08-08IntelFsp2Pkg DSC: Add build option to disable deprecated APIsHao Wu
Add the following definition in the [BuildOptions] section in package DSC files to disable APIs that are deprecated: [BuildOptions] *_*_*_CC_FLAGS = -D DISABLE_NEW_DEPRECATED_INTERFACES Cc: Jiewen Yao <jiewen.yao@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Hao Wu <hao.a.wu@intel.com> Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
2016-07-20IntelFsp2Pkg: Add missing modules in Package DSCLiming Gao
Package DSC is used to verify the module source build. Cc: Jiewen Yao <jiewen.yao@intel.com> Cc: Giri Mudusuru <giri.p.mudusuru@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Liming Gao <liming.gao@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
2016-05-13Add IntelFsp2Pkg and IntelFsp2WrapperPkg.Jiewen Yao
Add FSP2.0 support. This series of patch is to support FSP2.0 specification at https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf Some major updates include: 1) One FSP binary is separated to multiple components: FSP-T, FSP-M, FSP-S, and optional FSP-O. Each component has its own configuration data region. 2) All FSP-APIs use same UPD format - FSP_UPD_HEADER. 3) Add EnumInitPhaseEndOfFirmware notifyphase. 4) FSP1.1/FSP1.0 compatibility is NOT maintained. 5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg, to indicate that it is for FspWrapper only. IntelFspPkg and IntelFspWrapperPkg will be deprecated. The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg and IntelFsp2WrapperPkg. The old platform can still use IntelFspPkg and IntelFspWrapperPkg for compatibility consideration. Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com> Cc: Maurice Ma <maurice.ma@intel.com> Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com> Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Jiewen Yao <jiewen.yao@intel.com> Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com> Reviewed-by: Maurice Ma <maurice.ma@intel.com> Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>