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Keep NASM file only for new added modules.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Giri Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
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Manually convert X64/Thunk64To32.asm to X64/Thunk64To32.nasm
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Liming Gao <liming.gao@intel.com>
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gIntelFsp2WrapperTokenSpaceGuid.
We updated gIntelFspPkgTokenSpaceGuid to gIntelFsp2PkgTokenSpaceGuid
in IntelFsp2Pkg, but we miss the update in IntelFsp2WrapperPkg.
This patch fixed the issue and made them consistent.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Satya P Yarlagadda <satya.p.yarlagadda@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
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Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
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