Age | Commit message (Collapse) | Author |
|
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Guo Mang <mang.guo@intel.com>
|
|
Cc: Shumin Qiu <shumin.qiu@intel.com>
Cc: Feng Tian <feng.tian@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Shumin Qiu <shumin.qiu@intel.com>
|
|
The S3Ready() functional code in AcpiS3SaveDxe of IntelFrameworkModulePkg
is to do ACPI S3 Context save. In fact, that is not really related to
Intel framework ACPI S3 protocol.
IntelFrameworkModulePkg will be deprecated step by step, so move the
functional code to MdeModulePkg and S3SaveStateDxe is a good place.
The ACPI global variable related code is leaved as is in IntelFrameworkModulePkg
AcpiS3SaveDxe for compatibility.
PcdS3BootScriptStackSize is also moved from IntelFrameworkModulePkg.
The functional code need to get ACPI FACS table and consume LockBoxLib,
so need to be before DxeSmmReadyToLock that will shut down SMM lock box
interface, EndOfDxe is a good point (OVMF AcpiS3SaveDxe has the reference
implementation).
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Feng Tian <feng.tian@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Tested-by: Laszlo Ersek <lersek@redhat.com>
|
|
Cc: Feng Tian <feng.tian@intel.com>
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Laszlo Ersek <lersek@redhat.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Star Zeng <star.zeng@intel.com>
Reviewed-by: Laszlo Ersek <lersek@redhat.com>
Tested-by: Laszlo Ersek <lersek@redhat.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
|
|
1. Usage information in INF file comment blocks are either incomplete or incorrect.
This includes usage information for Protocols/PPIs/GUIDs/PCDs/HOBs/Events/BootModes.
The syntax for usage information in comment blocks is defined in the EDK II Module Information (INF) Specification
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Zeng, Star <star.zeng@intel.com>
Reviewed-by: Gao, Liming <liming.gao@intel.com>
git-svn-id: https://svn.code.sf.net/p/edk2/code/trunk/edk2@15962 6f19259b-4bc3-4df7-8a09-765794883524
|
|
MdeModulePkg on PcdLib
Signed-off-by: Tian Feng <feng.tian@intel.com>
Reviewed-by: Liming Gao <liming.gao@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
git-svn-id: https://edk2.svn.sourceforge.net/svnroot/edk2/trunk/edk2@13909 6f19259b-4bc3-4df7-8a09-765794883524
|
|
Signed-off-by: jljusten
Reviewed-by: mdkinney
Reviewed-by: rsun3
Reviewed-by: jyao1
git-svn-id: https://edk2.svn.sourceforge.net/svnroot/edk2/trunk/edk2@12228 6f19259b-4bc3-4df7-8a09-765794883524
|