From ca0fd665dcf6a4aeda07955d3898b03204c88fd8 Mon Sep 17 00:00:00 2001 From: Wendy Elsasser Date: Tue, 14 Feb 2017 15:09:18 -0600 Subject: mem: Update DRAM configuration names Names of DRAM configurations were updated to reflect both the channel and device data width. Previous naming format was: __ The following nomenclature is now used: __x where n = The number of devices per rank on the channel x = Device width Total channel width can be calculated by n*w Example: A 64-bit DDR4, 2400 channel consisting of 4-bit devices: n = 16 w = 4 The resulting configuration name is: DDR4_2400_16x4 Updated scripts to match new naming convention. Added unique configurations for DDR4 for: 1) 16x4 2) 8x8 3) 4x16 Change-Id: Ibd7f763b7248835c624309143cb9fc29d56a69d1 Reviewed-by: Radhika Jagtap Reviewed-by: Curtis Dunham --- src/mem/DRAMCtrl.py | 165 ++++++++++++++++++++++++++++++++++++++-------------- 1 file changed, 120 insertions(+), 45 deletions(-) (limited to 'src') diff --git a/src/mem/DRAMCtrl.py b/src/mem/DRAMCtrl.py index 616986c75..d1c5daf62 100644 --- a/src/mem/DRAMCtrl.py +++ b/src/mem/DRAMCtrl.py @@ -315,7 +315,7 @@ class DRAMCtrl(AbstractMemory): # A single DDR3-1600 x64 channel (one command and address bus), with # timings based on a DDR3-1600 4 Gbit datasheet (Micron MT41J512M8) in # an 8x8 configuration. -class DDR3_1600_x64(DRAMCtrl): +class DDR3_1600_8x8(DRAMCtrl): # size of device in bytes device_size = '512MB' @@ -410,7 +410,7 @@ class DDR3_1600_x64(DRAMCtrl): # configuration. # This configuration includes the latencies from the DRAM to the logic layer # of the HMC -class HMC_2500_x32(DDR3_1600_x64): +class HMC_2500_1x32(DDR3_1600_8x8): # size of device # two banks per device with each bank 4MB [2] device_size = '8MB' @@ -492,7 +492,7 @@ class HMC_2500_x32(DDR3_1600_x64): # options for the DDR-1600 configuration, based on the same DDR3-1600 # 4 Gbit datasheet (Micron MT41J512M8). Most parameters are kept # consistent across the two configurations. -class DDR3_2133_x64(DDR3_1600_x64): +class DDR3_2133_8x8(DDR3_1600_8x8): # 1066 MHz tCK = '0.938ns' @@ -520,35 +520,37 @@ class DDR3_2133_x64(DDR3_1600_x64): VDD = '1.5V' # A single DDR4-2400 x64 channel (one command and address bus), with -# timings based on a DDR4-2400 4 Gbit datasheet (Micron MT40A512M16) -# in an 4x16 configuration. -class DDR4_2400_x64(DRAMCtrl): +# timings based on a DDR4-2400 8 Gbit datasheet (Micron MT40A2G4) +# in an 16x4 configuration. +# Total channel capacity is 32GB +# 16 devices/rank * 2 ranks/channel * 1GB/device = 32GB/channel +class DDR4_2400_16x4(DRAMCtrl): # size of device - device_size = '512MB' + device_size = '1GB' - # 4x16 configuration, 4 devices each with an 16-bit interface - device_bus_width = 16 + # 16x4 configuration, 16 devices each with a 4-bit interface + device_bus_width = 4 # DDR4 is a BL8 device burst_length = 8 - # Each device has a page (row buffer) size of 2 Kbyte (1K columns x16) - device_rowbuffer_size = '2kB' + # Each device has a page (row buffer) size of 512 byte (1K columns x4) + device_rowbuffer_size = '512B' - # 4x16 configuration, so 4 devices - devices_per_rank = 4 + # 16x4 configuration, so 16 devices + devices_per_rank = 16 # Match our DDR3 configurations which is dual rank ranks_per_channel = 2 # DDR4 has 2 (x16) or 4 (x4 and x8) bank groups - # Set to 2 for x16 case - bank_groups_per_rank = 2 + # Set to 4 for x4 case + bank_groups_per_rank = 4 # DDR4 has 16 banks(x4,x8) and 8 banks(x16) (4 bank groups in all # configurations). Currently we do not capture the additional # constraints incurred by the bank groups - banks_per_rank = 8 + banks_per_rank = 16 # override the default buffer sizes and go for something larger to # accommodate the larger bank count @@ -562,7 +564,7 @@ class DDR4_2400_x64(DRAMCtrl): # tBURST is equivalent to the CAS-to-CAS delay (tCCD) # With bank group architectures, tBURST represents the CAS-to-CAS # delay for bursts to different bank groups (tCCD_S) - tBURST = '3.333ns' + tBURST = '3.332ns' # @2400 data rate, tCCD_L is 6 CK # CAS-to-CAS delay for bursts to the same bank group @@ -570,21 +572,23 @@ class DDR4_2400_x64(DRAMCtrl): # for CAS-to-CAS delay for bursts to different bank groups tCCD_L = '5ns'; - # DDR4-2400 16-16-16 - tRCD = '13.32ns' - tCL = '13.32ns' - tRP = '13.32ns' - tRAS = '35ns' + # DDR4-2400 17-17-17 + tRCD = '14.16ns' + tCL = '14.16ns' + tRP = '14.16ns' + tRAS = '32ns' - # RRD_S (different bank group) for 2K page is MAX(4 CK, 5.3ns) - tRRD = '5.3ns' + # RRD_S (different bank group) for 512B page is MAX(4 CK, 3.3ns) + tRRD = '3.332ns' - # RRD_L (same bank group) for 2K page is MAX(4 CK, 6.4ns) - tRRD_L = '6.4ns'; + # RRD_L (same bank group) for 512B page is MAX(4 CK, 4.9ns) + tRRD_L = '4.9ns'; - tXAW = '30ns' + # tFAW for 512B page is MAX(16 CK, 13ns) + tXAW = '13.328ns' activation_limit = 4 - tRFC = '260ns' + # tRFC is 350ns + tRFC = '350ns' tWR = '15ns' @@ -607,27 +611,98 @@ class DDR4_2400_x64(DRAMCtrl): tXP = '6ns' # self refresh exit time - tXS = '120ns' + # exit delay to ACT, PRE, PREALL, REF, SREF Enter, and PD Enter is: + # tRFC + 10ns = 340ns + tXS = '340ns' # Current values from datasheet - IDD0 = '70mA' - IDD02 = '4.6mA' - IDD2N = '50mA' - IDD3N = '67mA' + IDD0 = '43mA' + IDD02 = '3mA' + IDD2N = '34mA' + IDD3N = '38mA' IDD3N2 = '3mA' - IDD4W = '302mA' - IDD4R = '230mA' - IDD5 = '192mA' - IDD3P1 = '44mA' - IDD2P1 = '32mA' - IDD6 = '20mA' + IDD4W = '103mA' + IDD4R = '110mA' + IDD5 = '250mA' + IDD3P1 = '32mA' + IDD2P1 = '25mA' + IDD6 = '30mA' VDD = '1.2V' VDD2 = '2.5V' +# A single DDR4-2400 x64 channel (one command and address bus), with +# timings based on a DDR4-2400 8 Gbit datasheet (Micron MT40A1G8) +# in an 8x8 configuration. +# Total channel capacity is 16GB +# 8 devices/rank * 2 ranks/channel * 1GB/device = 16GB/channel +class DDR4_2400_8x8(DDR4_2400_16x4): + # 8x8 configuration, 8 devices each with an 8-bit interface + device_bus_width = 8 + + # Each device has a page (row buffer) size of 1 Kbyte (1K columns x8) + device_rowbuffer_size = '1kB' + + # RRD_L (same bank group) for 1K page is MAX(4 CK, 4.9ns) + tRRD_L = '4.9ns'; + + tXAW = '21ns' + + # Current values from datasheet + IDD0 = '48mA' + IDD3N = '43mA' + IDD4W = '123mA' + IDD4R = '135mA' + IDD3P1 = '37mA' + +# A single DDR4-2400 x64 channel (one command and address bus), with +# timings based on a DDR4-2400 8 Gbit datasheet (Micron MT40A512M16) +# in an 4x16 configuration. +# Total channel capacity is 4GB +# 4 devices/rank * 1 ranks/channel * 1GB/device = 4GB/channel +class DDR4_2400_4x16(DDR4_2400_16x4): + # 4x16 configuration, 4 devices each with an 16-bit interface + device_bus_width = 16 + + # Each device has a page (row buffer) size of 2 Kbyte (1K columns x16) + device_rowbuffer_size = '2kB' + + # 4x16 configuration, so 4 devices + devices_per_rank = 4 + + # Single rank for x16 + ranks_per_channel = 1 + + # DDR4 has 2 (x16) or 4 (x4 and x8) bank groups + # Set to 2 for x16 case + bank_groups_per_rank = 2 + + # DDR4 has 16 banks(x4,x8) and 8 banks(x16) (4 bank groups in all + # configurations). Currently we do not capture the additional + # constraints incurred by the bank groups + banks_per_rank = 8 + + # RRD_S (different bank group) for 2K page is MAX(4 CK, 5.3ns) + tRRD = '5.3ns' + + # RRD_L (same bank group) for 2K page is MAX(4 CK, 6.4ns) + tRRD_L = '6.4ns'; + + tXAW = '30ns' + + # Current values from datasheet + IDD0 = '80mA' + IDD02 = '4mA' + IDD2N = '34mA' + IDD3N = '47mA' + IDD4W = '228mA' + IDD4R = '243mA' + IDD5 = '280mA' + IDD3P1 = '41mA' + # A single LPDDR2-S4 x32 interface (one command/address bus), with # default timings based on a LPDDR2-1066 4 Gbit part (Micron MT42L128M32D1) # in a 1x32 configuration. -class LPDDR2_S4_1066_x32(DRAMCtrl): +class LPDDR2_S4_1066_1x32(DRAMCtrl): # No DLL in LPDDR2 dll = False @@ -726,7 +801,7 @@ class LPDDR2_S4_1066_x32(DRAMCtrl): # A single WideIO x128 interface (one command and address bus), with # default timings based on an estimated WIO-200 8 Gbit part. -class WideIO_200_x128(DRAMCtrl): +class WideIO_200_1x128(DRAMCtrl): # No DLL for WideIO dll = False @@ -795,7 +870,7 @@ class WideIO_200_x128(DRAMCtrl): # A single LPDDR3 x32 interface (one command/address bus), with # default timings based on a LPDDR3-1600 4 Gbit part (Micron # EDF8132A1MC) in a 1x32 configuration. -class LPDDR3_1600_x32(DRAMCtrl): +class LPDDR3_1600_1x32(DRAMCtrl): # No DLL for LPDDR3 dll = False @@ -895,7 +970,7 @@ class LPDDR3_1600_x32(DRAMCtrl): # A single GDDR5 x64 interface, with # default timings based on a GDDR5-4000 1 Gbit part (SK Hynix # H5GQ1H24AFR) in a 2x32 configuration. -class GDDR5_4000_x64(DRAMCtrl): +class GDDR5_4000_2x32(DRAMCtrl): # size of device device_size = '128MB' @@ -979,7 +1054,7 @@ class GDDR5_4000_x64(DRAMCtrl): # IDD measurement values, and by extrapolating data from other classes. # Architecture values based on published HBM spec # A 4H stack is defined, 2Gb per die for a total of 1GB of memory. -class HBM_1000_4H_x128(DRAMCtrl): +class HBM_1000_4H_1x128(DRAMCtrl): # HBM gen1 supports up to 8 128-bit physical channels # Configuration defines a single channel, with the capacity # set to (full_ stack_capacity / 8) based on 2Gb dies @@ -1068,7 +1143,7 @@ class HBM_1000_4H_x128(DRAMCtrl): # instantiated per pseudo-channel # Stay at same IO rate (1Gbps) to maintain timing relationship with # HBM gen1 class (HBM_1000_4H_x128) where possible -class HBM_1000_4H_x64(HBM_1000_4H_x128): +class HBM_1000_4H_1x64(HBM_1000_4H_1x128): # For HBM gen2 with pseudo-channel mode, configure 2X channels. # Configuration defines a single pseudo channel, with the capacity # set to (full_ stack_capacity / 16) based on 8Gb dies -- cgit v1.2.3