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author | Hao Wu <hao.a.wu@intel.com> | 2017-04-06 10:02:29 +0800 |
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committer | Hao Wu <hao.a.wu@intel.com> | 2017-04-06 15:43:08 +0800 |
commit | ca467f68f4ce520ad0250678c91e9623a0195902 (patch) | |
tree | 71f22aa482657b3bc8eb5cb9e3114da79f827289 | |
parent | 4aabee6980fb60aecc58e750560205abcf681236 (diff) | |
download | edk2-platforms-ca467f68f4ce520ad0250678c91e9623a0195902.tar.xz |
IntelFsp2WrapperPkg: Convert files to CRLF line ending
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Hao Wu <hao.a.wu@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
-rw-r--r-- | IntelFsp2WrapperPkg/Readme.md | 14 |
1 files changed, 7 insertions, 7 deletions
diff --git a/IntelFsp2WrapperPkg/Readme.md b/IntelFsp2WrapperPkg/Readme.md index 0b0f81b033..dfcb4c1a2e 100644 --- a/IntelFsp2WrapperPkg/Readme.md +++ b/IntelFsp2WrapperPkg/Readme.md @@ -1,7 +1,7 @@ -# IntelFsp2WrapperPkg - -This package provides the component to use an FSP binary. - -Source Repository: https://github.com/tianocore/edk2/tree/master/IntelFsp2WrapperPkg - -A whitepaper to describe the IntelFsp2WrapperPkg: https://firmware.intel.com/sites/default/files/A_Tour_Beyond_BIOS_Using_the_Intel_Firmware_Support_Package_with_the_EFI_Developer_Kit_II_%28FSP2.0%29.pdf
\ No newline at end of file +# IntelFsp2WrapperPkg
+
+This package provides the component to use an FSP binary.
+
+Source Repository: https://github.com/tianocore/edk2/tree/master/IntelFsp2WrapperPkg
+
+A whitepaper to describe the IntelFsp2WrapperPkg: https://firmware.intel.com/sites/default/files/A_Tour_Beyond_BIOS_Using_the_Intel_Firmware_Support_Package_with_the_EFI_Developer_Kit_II_%28FSP2.0%29.pdf
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