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author | Matthias Jung <jungma@eit.uni-kl.de> | 2015-06-07 14:02:40 -0500 |
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committer | Matthias Jung <jungma@eit.uni-kl.de> | 2015-06-07 14:02:40 -0500 |
commit | 25fe4c25291db84c314ed979b3afbb49a3fa7306 (patch) | |
tree | 12ec9beffb43c9ff2423a65927651a30ae4b959f /util/tap | |
parent | 736d3314bff0f3457ee9c86989a2942f4fbce510 (diff) | |
download | gem5-25fe4c25291db84c314ed979b3afbb49a3fa7306.tar.xz |
mem: Add HMC Timing Parameters
A single HMC-2500 x32 model based on:
[1] DRAMSpec: a high-level DRAM bank modelling tool developed at the University
of Kaiserslautern. This high level tool uses RC (resistance-capacitance) and CV
(capacitance-voltage) models to estimate the DRAM bank latency and power
numbers.
[2] A Logic-base Interconnect for Supporting Near Memory Computation in the
Hybrid Memory Cube (E. Azarkhish et. al) Assumed for the HMC model is a 30 nm
technology node. The modelled HMC consists of a 4 Gbit part with 4 layers
connected with TSVs. Each layer has 16 vaults and each vault consists of 2
banks per layer. In order to be able to use the same controller used for 2D
DRAM generations for HMC, the following analogy is done: Channel (DDR) => Vault
(HMC) device_size (DDR) => size of a single layer in a vault ranks per channel
(DDR) => number of layers banks per rank (DDR) => banks per layer devices per
rank (DDR) => devices per layer ( 1 for HMC). The parameters for which no
input is available are inherited from the DDR3 configuration.
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